Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Impedance Spectroscopy and Cell Constant of the Electrodes for Deep Brain Stimulation

E. Vinter[1], S. Petersen[1], J. Gimsa[2], and U. van Rienen[1]

[1]Institute of General Electrical Engineering, University of Rostock, Rostock, Germany
[2]Institute of Biology, University of Rostock, Rostock, Germany

To achieve a deeper understanding of the mechanism of the Deep Brain Stimulation (DBS) scientists use more and more numerical simulations. DBS inhibits overreaching brain activity via electric pulses that send into the brain by electrodes. Different electrode parameters such as geometry, frequency of stimulated impulse or applied voltage have a great influence on the size of the stimulated ...

Mathematical Model of Blood Flow in Carotid Bifurcation

E. Muraca[1], V. Gramigna[1], and G. Fragomeni[1]
[1]Department of Experimental Medicine and Clinic, Magna Graecia University of Catanzaro, Catanzaro, Italy

The goal of this research is to provide the medical staff with a numerical system assessment of wall shear stress in carotid bifurcation. Through this model, it will be fundamental to investigate the stress state properties of the surface in contact between the plaque and the artery, and study the geometric relationship between the bifurcation angle and fluid structural properties. The formation ...

Using COMSOL Multiphysics® for Biomechanical Analysis of Stent Technology in Cerebral Aneurysms

J. Rasmussen[1], M.S. Enevoldsen[1], J. Thyregod[2], and K-A. Henneberg[1]
[1]Department of Electrical Engineering, Technical University of Denmark, Kgs. Lyngby, Denmark
[2]COOK Medical Europe, Bjaeverskov, Denmark

This work presents new Fluid-Structure Interaction (FSI) models in both 2D and 3D of the effect of using vascular stents as treatment of cerebral berry aneurysms. The stent is positioned inside the cerebral artery covering the neck of the aneurysm. The stent is expected to alter the blood flow into the aneurysm such that the blood coagulates due to low blood velocity, and rupture of the aneurysm ...

Simulation Bubble Nucleation and Bubble Growth of a Thermal-Bubble Microejector

Z. Hongwei[1] and A.M. Gué[1]
[1]Laboratoire d’Analyse et d’Architecture de Systèmes, Université de Toulouse, Toulouse, France

The present study investigates simulation model and droplet ejection performance of a thermal-bubble microejector. This model simulates the bubble nucleation and the bubble growth, to predict the droplet ejection process. Specificity, it is achieved by coupling an electric-thermal model and flow model with bubble dynamics equations. The model is validated by comparing prediction results with ...

Finite Element Analysis of Thermal Fatigue in Thermal Barrier Coatings

U. Bardi[1], C. Borri[1], A. Fossati[1], A. Lavacchi[1], and I. Perissi[1]
[1]Dipartimento di Chimica, Università degli Studi di Firenze, Sesto Fiorentino, FI, Italy

A Finite element model of plasma sprayed TBC’s was developed to estimate the stress induced by thermal cycling experiments. A heat transfer analysis was performed to evaluate the temperature distribution on the specimen during the cooling under an impinging air jet; temperature measurements performed with an infrared pyrometer on the cooled samples show good agreement with the evaluated ...

Multi-Objective Optimization of a Ball Grid Array Using modeFRONTIER® and COMSOL Multiphysics®

H. Strandberg[1], T. Makkonen[2], and J. Leinvuo[2]
[1]ESTECO Nordic AB, Lund, Sweden
[2]VTI Technologies Oy, Vantaa, Finland

Capacitive MEMS (Micro-Electro-Mechanical Systems) accelerometers may be directly soldered to the printed circuit board by an array of solder balls. Differences in the thermal expansion coefficients of the pertinent materials cause deformations of the accelerometer under temperature change. This may cause a relative movement of the sensing masses with respect to the sensing electrodes, resulting ...

Second Order Drift Forces on "Offshore" Wave Energy Converters

L. Martinelli[1], A. Lamberti[1], and P. Ruol[2]

[1]DISTART Idraulica, Università di Bologna, Bologna, Italy
[2]IMAGE, Università di Padova, Padova, Italy

Objective of this contribution is to present a procedure for evaluating second order drift forces on floating bodies, often the most important loading component for mooring design, in case of high waves propagating in relatively shallow water depths. The non linearity associated to this condition, which is typical of installations involving wave energy converters, makes this problem particularly ...

Finite Element Modeling for the Mechanical Behavior of Silicon Diaphragms Using COMSOL Multiphysics®

J. Ren[1], M. Ward[1], Peter Kinnell[2], and Russell Cradock[2]

[1]School of Mechanical Engineering, University of Birmingham, Birmingham, United Kingdom
[2]GE Druck Limited, Fir Tree Lane, Leicester, United Kingdom

The silicon diaphragm is one of the most common structures in Micro-Electromechanical Systems (MEMS). However, it is susceptible to creep deformation at elevated temperatures. This paper presents a transient finite element model which simulates the mechanical behavior of the micromachined silicon diaphragms at the temperature of 900 °C. The constitutive equations proposed by Alexander and ...

Dynamic Crack Propagation in Fiber Reinforced Composites

C. Caruso[1], P. Lonetti[1], and A. Manna[1]

[1]Department of Structural Engineering, University of Calabria, Arcavacata di Rende, CS, Italy

A generalized model to predict dynamic crack propagation in fiber composite structures is proposed. The proposed approach is based on a generalized formulation based on the Fracture Mechanics approach and Moving mesh methodology. Consistently to the Fracture Mechanics, the crack propagation depends from the energy release rate and its mode components, which are calculated by means of the ...

Modeling of Silicon Transport into Germanium Using a Simplified Crystal Growth Technique

F. Mechighel[1][3], B. Pateyron[1], M. El Ganaoui[1], S. Dost[2], and M. Kadja[3]

[1]Laboratory SPCTS UMR CNRS, ENSCI, Limoges University, Limoges, France
[2]Crystal Growth Laboratory, Department of Mechanical Engineering, University of Victoria, British Columbia, Victoria, Canada
[3]Department of Mechanical Engineering, University of Constantine, Constantine, Algeria

A numerical simulation study, using COMSOL Multiphysics®, was carried out to examine the temperature and concentration fields in the dissolution process of silicon into germanium melt. This work utilized a simplified configuration which may be considered to be similar material configuration to that used in the Vertical Bridgman growth methods. The concentration profile for the SiGe sample ...