Numerical Modeling of Resistance Welding Process in Joining of Thermoplastic Composite Materials Using COMSOL Multiphysics®
R. Carbone and A. Langella
Material and Production Engineering Department, Università degli Studi di Napoli Federico II, Napoli, Italy
This paper deals of a technology involved in the joining of thermoplastic composites, the resistance welding technology. This process takes advantage in the repeatable melting process for the thermoplastic resins. The process was numerically modeled to study the effect of the two main process parameters, the electric power density applied to the heating elements and the exposure time at the ...
A Preliminary Approach to the Neutronics of the Molten Salt Reactor by Means of COMSOL Multiphysics®
V. Memoli, A. Cammi, V. Di Marcello, and L. Luzzi
Nuclear Engineering Division, Department of Energy, Politecnico di Milano, Milano, Italy
The Molten Salt Reactor (MSR), proposed along with other five innovative concepts of fission nuclear reactor by the Generation IV International Forum (GIF-IV), represents a challenging task from the modeling perspective because of the strong coupling between neutronics and thermo-hydrodynamics due to liquid fuel circulation in the primary loop. In this paper COMSOL Multiphysics® is adopted to ...
G.S. Durante and M. Fretz
CSEM Zentralschweiz, Alpnach Dorf, Switzerland
Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...
V.M. Rodriguez-Zermeno, M.P. Sørensen, N.F. Pedersen, N. Mijatovic, and A.B. Abrahamsen
DTU Mathematics, Lyngby, Denmark
DTU Electrical Engineering, Lyngby, Denmark
Materials Research Division, Risø, DTU, Roskilde, Denmark
This work presents a method to calculate AC losses in thin conductors such as the commercially available second generation superconducting wires through a multiscale meshing technique. The main idea is to use large aspect ratio elements to accurately simulate thin material layers. For a single thin superconductor, several standard test cases are simulated including transport current, externally ...
M. Cobianchi and R. Magalotti
 B&C Speakers S.p.a., Bagno a Ripoli, FI, Italia
In modern live sound reinforcement there is a growing use of line sources, obtained through the stacking of many loudspeakers with properly controlled wavefront shape. Thus the use of waveguides is mandatory in order to modify the shape and size of the wavefront exiting from professional compression drivers. With the help of COMSOL Multiphysics®, we have designed a waveguide featuring an ...
J. Bouhattate, X. Feaugas, and S. Frappart
Laboratoire d’Etudes des Matériaux en Milieux Agressifs,
Université de La Rochelle, La Rochelle, France
V&M France, CEV, Aulnoye-Aymeries, France
Hydrogen Embrittlement (HE) is one of the mechanisms responsible for premature failure of structures. In the context of environmental sustainability, it is compelling to improve or conceive new processes and/or new materials capable of reducing fracture induced by HE. We analyzed the influence of the oxide layer on the permeability of hydrogen. This investigation was carried on as a correlative ...
H. Strandberg, T. Makkonen, and J. Leinvuo
ESTECO Nordic AB, Lund, Sweden
VTI Technologies Oy, Vantaa, Finland
Capacitive MEMS (Micro-Electro-Mechanical Systems) accelerometers may be directly soldered to the printed circuit board by an array of solder balls. Differences in the thermal expansion coefficients of the pertinent materials cause deformations of the accelerometer under temperature change. This may cause a relative movement of the sensing masses with respect to the sensing electrodes, resulting ...
Level Set Method for Fully Thermal-Mechanical Coupled Simulations of Filling in Injection and Micro-Injection Molding Process
M. Moguedet, R. Le Goff, P. Namy, and Y. Béreaux
Pôle Européen de Plasturgie, Bellignat, France
SIMTEC, Grenoble, France
INSA de Lyon, Site de Plasturgie, Bellignat, France
In this work we tackle a more theoretical aspect of micro-injection molding, to better understand physics during the process, through numerical simulations of cavity filling. We developed a two phase flow approach by the use of COMSOL Multiphysics®. In a first step, a Level Set model is applied to several configurations: Newtonian and non Newtonian fluid (Cross viscosity law), coupled with a ...
U. Bardi, C. Borri, A. Fossati, A. Lavacchi, and I. Perissi
Dipartimento di Chimica, Università degli Studi di Firenze, Sesto Fiorentino, FI, Italy
A Finite element model of plasma sprayed TBC’s was developed to estimate the stress induced by thermal cycling experiments. A heat transfer analysis was performed to evaluate the temperature distribution on the specimen during the cooling under an impinging air jet; temperature measurements performed with an infrared pyrometer on the cooled samples show good agreement with the evaluated ...
Z. Hongwei and A.M. Gué
Laboratoire d’Analyse et d’Architecture de Systèmes, Université de Toulouse, Toulouse, France
The present study investigates simulation model and droplet ejection performance of a thermal-bubble microejector. This model simulates the bubble nucleation and the bubble growth, to predict the droplet ejection process. Specificity, it is achieved by coupling an electric-thermal model and flow model with bubble dynamics equations. The model is validated by comparing prediction results with ...