Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Modeling of Usage of Air Injection Well in a Geothermal System

X. Ma[1] and J. Grabe[1]

[1]Institude for Geotechnics and Construction Management, Hamburg University of Technology, Hamburg, Germany

Natural groundwater flow can increase the efficiency of geothermal system. But groundwater flow is not available everywhere. A patented new idea is to use air injection well to create artificial flow in sandy or gritty soils. The governing equations of fluid flow and heat transfer problem were solved with the COMSOL’s Earth Science Module.

Temperature Distribution in High Voltage Dummy Cable

G.Y. Sun[1], O. Sekula[1], and C. Albanbauer[1]
[1]Brugg Kabel AG, Brugg, Switzerland

A 2D model of coupled electricthermal application is used to calculate the temperature distribution in a high voltage dummy cable laid in free air, where no high voltage is applied. Resistive loss heats the cable while the surrounding air cools it down. The steady-state condition is reached when heat balances. The steady-state temperature depends not only on the resistive loss but also on the ...

Calculating Power Loss of Contactless Power Transmission Systems with Ferrite Components

S. Hanf[1] and D. Kürschner[1]
[1]Institut für Automation und Kommunikation Magdeburg, Magdeburg, Germany

In this paper a methodology for calculating loss within contactless inductive power transmission systems, resulting from hysteresis and eddy current effects, is presented. The usage of the mathematical models of Stoll and Steinmetz for the determination of core loss with COMSOL is explained. Apart from the metrological verification of selected aspects of power loss, the results of a parametrical ...

Thermal and Electrostatic Analyses of One Dimensional CFC Diagnostic Calorimeter for SPIDER Beam Characterisation

M. De Muri[1][2], M. Dalla Palma[1], P. Veltri[1], A. Rizzolo[1], N. Pomaro[1], and G. Serianni[1]
[1]Consorzio RFX, Euratom-ENEA Association, Padova, Italy
[2]Dipartimento di Ingegneria Elettrica, Padova University, Padova, Italy

The main purpose of SPIDER (Source for the Production of Ions of Deuterium Extracted from RF plasma) test facility is the investigation and optimization of a negative ion beam produced by the full size ion source for ITER NBIs (Neutral Beam Injectors). Thermal, transient, non-linear FE (Finite Element) analyses and also electrostatic analysis have been performed as a feasibility study, to ...

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...

Thermal Design of Power Electronic Devices and Modules

N. Delmonte[1], M. Bernardoni[1], P. Cova[1], and R. Menozzi[1]
[1]Dipartimento di Ingegneria dell’Informazione, University of Parma, Parma, Italy

This work describes a way to apply 3D Finite Element Analysis (FEA) to the thermal design of power electronic modules using simplified geometry models of the system components. The method here presented can overcome the problem of solving equation systems with a very high number of Degrees Of Freedom (DOF) due to complex geometry of a power module.

An Acoustical Finite Element Model of Perforated Elements

P. Bonfiglio[1][2] and F. Pompoli[1][2]
[1]Materiacustica S.r.l., Ferrara, Italy
[2]Engineering Department, University of Ferrara, Ferrara, Italy

The present work deals with a numerical investigation of resonating systems used for noise control applications. In literature one can find analytical models based on fluiddynamics concepts for evaluating losses occurring across the holes of the perforates. In the paper an acoustical formulation based on the equivalent dissipative fluid approach will be analyzed. It will be firstly applied to ...

The Full-System Approach for Elastohydrodynamic Lubrication

N. Fillot[1], T. Doki-Thonon[1], and W. Habchi[2]
[1]CNRS, INSA, Université de Lyon, Lyon, France
[2]Department of Industrial and Mechanical Engineering, Lebanese American University, Byblos, Lebanon

A ball is in contact with a plane, and a lubricant separates the two surfaces to decrease friction during their relative motion. To avoid wear, the lubricant film thickness should be higher than the surface roughness. The goal of this paper is to show how it is possible to solve efficiently the problem of elastohydrodynamics lubrication with COMSOL Multiphysics®, using a PDE (Partial ...

Simulation Bubble Nucleation and Bubble Growth of a Thermal-Bubble Microejector

Z. Hongwei[1] and A.M. Gué[1]
[1]Laboratoire d’Analyse et d’Architecture de Systèmes, Université de Toulouse, Toulouse, France

The present study investigates simulation model and droplet ejection performance of a thermal-bubble microejector. This model simulates the bubble nucleation and the bubble growth, to predict the droplet ejection process. Specificity, it is achieved by coupling an electric-thermal model and flow model with bubble dynamics equations. The model is validated by comparing prediction results with ...

Multi-Objective Optimization of a Ball Grid Array Using modeFRONTIER® and COMSOL Multiphysics®

H. Strandberg[1], T. Makkonen[2], and J. Leinvuo[2]
[1]ESTECO Nordic AB, Lund, Sweden
[2]VTI Technologies Oy, Vantaa, Finland

Capacitive MEMS (Micro-Electro-Mechanical Systems) accelerometers may be directly soldered to the printed circuit board by an array of solder balls. Differences in the thermal expansion coefficients of the pertinent materials cause deformations of the accelerometer under temperature change. This may cause a relative movement of the sensing masses with respect to the sensing electrodes, resulting ...