Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Numerical Modeling of Resistance Welding Process in Joining of Thermoplastic Composite Materials Using COMSOL Multiphysics®

R. Carbone[1] and A. Langella[1]
[1]Material and Production Engineering Department, Università degli Studi di Napoli Federico II, Napoli, Italy

This paper deals of a technology involved in the joining of thermoplastic composites, the resistance welding technology. This process takes advantage in the repeatable melting process for the thermoplastic resins. The process was numerically modeled to study the effect of the two main process parameters, the electric power density applied to the heating elements and the exposure time at the ...

A Preliminary Approach to the Neutronics of the Molten Salt Reactor by Means of COMSOL Multiphysics®

V. Memoli[1], A. Cammi[1], V. Di Marcello[1], and L. Luzzi[1]
[1]Nuclear Engineering Division, Department of Energy, Politecnico di Milano, Milano, Italy

The Molten Salt Reactor (MSR), proposed along with other five innovative concepts of fission nuclear reactor by the Generation IV International Forum (GIF-IV), represents a challenging task from the modeling perspective because of the strong coupling between neutronics and thermo-hydrodynamics due to liquid fuel circulation in the primary loop. In this paper COMSOL Multiphysics® is adopted to ...

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...

Fast 2D Simulation of Superconductors: A Multiscale Approach

V.M. Rodriguez-Zermeno[1], M.P. Sørensen[1], N.F. Pedersen[2], N. Mijatovic[2], and A.B. Abrahamsen[3]
[1]DTU Mathematics, Lyngby, Denmark
[2]DTU Electrical Engineering, Lyngby, Denmark
[3]Materials Research Division, Risø, DTU, Roskilde, Denmark

This work presents a method to calculate AC losses in thin conductors such as the commercially available second generation superconducting wires through a multiscale meshing technique. The main idea is to use large aspect ratio elements to accurately simulate thin material layers. For a single thin superconductor, several standard test cases are simulated including transport current, externally ...

Optimization of an Acoustic Waveguide for Professional Audio Applications

M. Cobianchi[1] and R. Magalotti[1]
[1] B&C Speakers S.p.a., Bagno a Ripoli, FI, Italia

In modern live sound reinforcement there is a growing use of line sources, obtained through the stacking of many loudspeakers with properly controlled wavefront shape. Thus the use of waveguides is mandatory in order to modify the shape and size of the wavefront exiting from professional compression drivers. With the help of COMSOL Multiphysics®, we have designed a waveguide featuring an ...

Modelling of the Hydrogen Diffusion in Martensitic Steel in Contact with H2SO4 Media

J. Bouhattate[1], X. Feaugas[1], and S. Frappart[1][2]
[1]Laboratoire d’Etudes des Matériaux en Milieux Agressifs,
Université de La Rochelle, La Rochelle, France
[2]V&M France, CEV, Aulnoye-Aymeries, France

Hydrogen Embrittlement (HE) is one of the mechanisms responsible for premature failure of structures. In the context of environmental sustainability, it is compelling to improve or conceive new processes and/or new materials capable of reducing fracture induced by HE. We analyzed the influence of the oxide layer on the permeability of hydrogen. This investigation was carried on as a correlative ...

Multi-Objective Optimization of a Ball Grid Array Using modeFRONTIER® and COMSOL Multiphysics®

H. Strandberg[1], T. Makkonen[2], and J. Leinvuo[2]
[1]ESTECO Nordic AB, Lund, Sweden
[2]VTI Technologies Oy, Vantaa, Finland

Capacitive MEMS (Micro-Electro-Mechanical Systems) accelerometers may be directly soldered to the printed circuit board by an array of solder balls. Differences in the thermal expansion coefficients of the pertinent materials cause deformations of the accelerometer under temperature change. This may cause a relative movement of the sensing masses with respect to the sensing electrodes, resulting ...

Level Set Method for Fully Thermal-Mechanical Coupled Simulations of Filling in Injection and Micro-Injection Molding Process

M. Moguedet[1], R. Le Goff[1], P. Namy[2], and Y. Béreaux[3]
[1]Pôle Européen de Plasturgie, Bellignat, France
[2]SIMTEC, Grenoble, France
[3]INSA de Lyon, Site de Plasturgie, Bellignat, France

In this work we tackle a more theoretical aspect of micro-injection molding, to better understand physics during the process, through numerical simulations of cavity filling. We developed a two phase flow approach by the use of COMSOL Multiphysics®. In a first step, a Level Set model is applied to several configurations: Newtonian and non Newtonian fluid (Cross viscosity law), coupled with a ...

Finite Element Analysis of Thermal Fatigue in Thermal Barrier Coatings

U. Bardi[1], C. Borri[1], A. Fossati[1], A. Lavacchi[1], and I. Perissi[1]
[1]Dipartimento di Chimica, Università degli Studi di Firenze, Sesto Fiorentino, FI, Italy

A Finite element model of plasma sprayed TBC’s was developed to estimate the stress induced by thermal cycling experiments. A heat transfer analysis was performed to evaluate the temperature distribution on the specimen during the cooling under an impinging air jet; temperature measurements performed with an infrared pyrometer on the cooled samples show good agreement with the evaluated ...

Simulation Bubble Nucleation and Bubble Growth of a Thermal-Bubble Microejector

Z. Hongwei[1] and A.M. Gué[1]
[1]Laboratoire d’Analyse et d’Architecture de Systèmes, Université de Toulouse, Toulouse, France

The present study investigates simulation model and droplet ejection performance of a thermal-bubble microejector. This model simulates the bubble nucleation and the bubble growth, to predict the droplet ejection process. Specificity, it is achieved by coupling an electric-thermal model and flow model with bubble dynamics equations. The model is validated by comparing prediction results with ...