Explore the innovative ways multiphysics simulation is being used worldwide to advance research
Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.
Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.
View the COMSOL Conference 2026 Collection
The aim of this study is to evaluate the airflow thermal distribution inside a storehouse in different operational conditions. A warehouse of 12,600 m3 in volume is considered for fluid-dynamical and thermal analysis. Coupled Navier-Stokes and energy equations are solved considering or ... Read More
The throwing power is an important criterion for the industrial use of an electrolyte in electroplating applications. Using the Electrodeposition Module and COMSOL Multiphyiscs® it is possible to simulate the thickness distribution for various electroplating geometries. For a realistic ... Read More
To this day seamless accessibility of local or cloud hardware for high performance computing as well as time consuming workflows involving sequencing and orchestration of available hardware for multiple simulation runs, remain limiting factors within the field of Multiphysics simulation ... Read More
The aim of this investigation is to apply computational fluid dynamics simulations to support the design development of an impaction-based probe collector. This collector should allow submicron aerosol impactions in the supersonic free stream radially aside a sounding rocket body in the ... Read More
Over the past million years, several cold ages have occurred and thereby caused perma-frost conditions basically all over the present area of Germany. Since in Germany the safe-ty of a nuclear waste repository legally needs to be investigated for a period of one million years, the ground ... Read More
In this paper, we present a study of the simulation of Directed Energy Deposition (DED) Additive Manufacturing (AM) using a multiphysics approach. We use a combination of Heat Transfer in Fluids, Solid Mechanics and Laminar Flow physics to accurately simulate the DED process. The ... Read More
While copper remains the dominant material for conduction paths in printed circuit board (PCB) applications, both technological and economic reasons have been motivating research on substituting copper with aluminum (Al). Despite its 60 % higher specific electrical resistance, aluminum ... Read More
High power consumption chips have already become a major challenge for modern processors causing low thermal performances. Existing thermal solutions are not able to solve these high temperature issues efficiently. Two-phase cooling devices such as heat pipes and vapor chambers have ... Read More
