See How Modeling and Simulation Is Used Across Industries
Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.
Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.
View the COMSOL Conference 2025 Collection
The development of microfluidic components for implementation of a lab-on-chip system requires both fluid movements under a controlled environment as well as sensitive detection. This work involves the design and simulation of micro-reactors with integrated heating as well as optical ... Read More
Modelling 3D IC structures with Through Silicon Vias (TSVs) and micro bumps is a promising technique to achieve “more than Moore” integration. Conventionally, Copper (Cu) is used as a TSV material. However, due to rapid scaling of interconnect, problems like electro-migration and surface ... Read More
Lyophilization is a dehydration process used to preserve perishable material like food. It depends on many parameters like temperature, pressure, rate of drying, type of heating for sublimation, chamber size etc. Therefore, optimization of multiple parameters is required for design and ... Read More
Laser material processing at micro-meter domain can be used for a plethora of applications such as micro drilling, micro welding, micro cutting, micro-texturing as well as micro polishing. These processes are governed by the time varying, complex melt hydrodynamics courtesy of melting ... Read More
An accelerometer detects acceleration and tilt of a device. There are several areas where accelerometers are in use, e.g. aerospace, navigation, automotive industry, electronic gadgets etc. According to different working principle, there are different types of accelerometer, e.g. piezo ... Read More
This paper presents numerical investigation of electronic thermal control using heat sink for integrated circuit (IC) chip cooling under forced convection in a horizontal channel. Steady state, three dimensional, incompressible, laminar forced convection cooling of chip attached with ... Read More
This paper presents numerical investigation on heated blocks under natural convection in a vertical channel for heat transfer enhancement. Three dimensional, steady state, incompressible, laminar natural convection in a vertical channel have been studied. The problem is modeled and ... Read More
This paper investigates numerical simulation of electronic chips mounted on substrate of multilayer copper clad board (k = 40.5 W/m K) in a horizontal channel under laminar forced convection. The heat sinks made of aluminum ( k = 160 W/m K) is attached to the silicon chips in order to ... Read More
Working performance of an disconnector is affected by maximum permissible temperature which is caused by the ohmic heat losses of & eddy current losses. Since experimental testing is expensive & time consuming, a 3D thermal analysis model of double break rotating blade (DBRB) 33 ... Read More
Thermophysical measurements of the Moon gained importance in light of recent results from various instruments onboard lunar missions such as LRO, GRAIL and Chandrayaan-1. Although heat flow measurements will be of top priority for future in situ geophysical exploration of the Moon, no ... Read More