Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Numerical Prediction of Weld Bead Geometry in Plasma Arc Welding of Titanium Sheets - new

V. Dhinakaran[1], S. Khope[1], N. S. Shanmugam[1] , K. Sankaranarayanasamy[1]
[1]National Institute of Technology, Tiruchirappalli, Tiruchirappalli, Tamil Nadu, India

Plasma Arc Welding (PAW) is one of the important arc welding processes commonly used in electronics, medical, automotive and aerospace industries due its high accuracy, finishing, and ability of welding any hard materials. It is an extension of Tungsten Inert Gas welding (TIG or GTAW). PAW has been unnoticed because it is more complex and requires more expensive equipment compared to other ...

Thermal Analysis of Induction Furnace

A. A. Bhat[1], S. Agarwal [1], D. Sujish[1], B. Muralidharan[1], B. P. Reddy[1], G. Padmakumar[1], K. K. Rajan[1]
[1]Indira Gandhi Center for Atomic Research, Kalpakkam, Tamilnadu, India

Induction furnaces are employed for vacuum distillation process to recover heavy metals after electro-refining operation. Induction furnace of suitable heating rate and cooled by passive means are required to be developed for this purpose. It is planned to set up a mock up induction furnace which will simulate the conditions to be realized in actual vacuum distillation furnace for this purpose. ...

Modeling Residual Stresses in Arc Welding

F. Roger[1], and A. Traidia[2]
[1]ENSTA Paristech, Paris, France
[2]AREVA NP, Saint Marcel, France

The prediction of mechanical response of assemblies during arc welding necessitates the knowledge of thermal history of the components and the constitutive behavior of the materials. COMSOL can simulate thermal and structural interaction but it needs to evaluate the time evolution of internal variables like viscoplastic strain and hardening parameters. In the present paper we extend the ...

Numerical Computation of Two-Phase Flow in Porous Media

D. Droste[1], F. Lindner[1], C. Mundt[1], M. Pfitzner[1]
[1]Universität der Bundeswehr, Munich, Bavaria, Germany

In this study we investigate the heat and mass transfer in a porous media with phase change. The liquid fluid is injected from one side and heated from the other side, where it leaves the porous material in a gaseous state. Dominant forces are capillary interactions and two-phase heat conduction. To model the process we use a two-phase mixture model on a macroscopic scale. This model is ...

Enthalpy Porosity Method for CFD Simulation of Natural Convection Phenomenon for Phase Change Problems in the Molten Pool and its Importance during Melting of Solids

Priyanshu Goyal[1], Anu Dutta[1], V.Verma[1], I. Thangamani[1], R.K. Singh[1]
[1]Bhabha Atomic Research Centre, Mumbai, India

Shielded transportation casks are commonly used for transportation and storage of radioactive waste materials. Design approval of such casks by regulatory authority is subject to its compliance with a thermal test (among other tests) Due to exposure of cask to fire , there is a possibility of melting of the shielding material (lead) used for the cask and need to evaluate extent of melting. ...

2D Simulations and Electro-Thermal Analysis of Microheater Designs using COMSOL for Gas Sensor Applications

G. Velmathi, N. Ramshanker, and S. Mohan
Department of Instrumentation, Indian Institute of Science, Bangalore, Karnataka, India

Microheaters have been widely investigated because of their extensive applications in gas sensors, flow rate sensors and other Microsystems. The geometric optimization for the microheater was performed by simulating a wide range of possible geometries using COMSOL Multiphysics, a commercial Finite Element Analysis (FEA) package. The simulated results of Microheaters having an improved ...

Simulation of Cascaded Thermoelectric Devices for Cryogenic Medical Treatment - new

P. Aliabadi[1], S. Mahmoud[1], R. K. AL-Dadah[1]
[1]Mechanical Engineering Department, University of Birmingham, Birmingham, UK

This study is focused on using a thermoelectric device (TED) as an alternative to the cryogenic liquid for cooling cryosurgical probe used for cancerous tissue ablation. Thermoelectric device, namely Peltier, is a solid state device which converts electric current to thermal gradient. In past years thermoelectric devices have been successfully utilized in refrigeration and air conditioning ...

Modeling of a Magnetocaloric System for Electric Vehicles

A. Noume[1], C. Vasile[1], M. Risser[1]
[1]National Institute of Applied Science (INSA), Strasbourg, France

In automotive industry, regardless the type of engine we use, heating and air-conditioning is responsible for the highest energy consumption among all the auxiliary systems all over the year. For conventional vehicles with thermal engines, the heating of the internal space is easy obtainable because of the heat waste from the engine. For the electric vehicles, as the energy is delivered by the ...

Three-Dimensional Thermal Modeling of Temperature Variation in Concrete Box-Girders Using COMSOL Multiphysics® - new

S. Abid[1,2], N. Tayşi[1], M. Özakça[1]
[1]Gaziantep University, Gaziantep, Turkey
[2]Wasit University, Kut, Iraq

The COMSOL's Heat Transfer module was used in this study to evaluate the temperature distribution in concrete box-girders subjected to exterior thermal conditions. The included thermal loads were air temperature, wind speed in addition to solar radiation. Moreover, the reflected radiation from the ground and other surroundings in addition to the mutual radiation between the different surfaces of ...

Power Transistor Heat Sink Design Trade-offs

T. Eppes, I. Milanovic, and G. Quarshie
University of Hartford
West Hartford, CT

Power transistors require heat sinks to dissipate thermal energy and keep junction temperatures below the recommended limit. The reliability and longevity of any semiconductor device is inversely proportional to the junction temperature. Hence, a significant increase in reliability and component life can be achieved by a small reduction in operating temperature. A range of heat sink designs ...