See How Modeling and Simulation Is Used Across Industries
Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.
Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.
View the COMSOL Conference 2025 Collection
In this work COMSOL is utilized to obtain the Mason lumped parameter model for a piezoelectric transformer (PT) design. The Mason lumped parameters are relevant in the design process of power converters. The magnitude of the impedance is simulated for a specific interleaved multilayer ... Read More
Accurate and efficient computation of electrical parameters for different conducting bodies represents an essential part of spacecraft modern integrated circuits. In this paper, we will illustrate modeling of inhomogeneous quasi-TEM shielded rectangular, cylindrical, and triangular ... Read More
In this research work, we developed a virtual model to examine the electrical conductivity of multilayered thin films when positioned above a single layer and multilayers of graphene, and flexible polyethylene terephthalate (PET) substrate. Additional structured thin films were ... Read More
Curved cone corrugated ground plane conical antenna has been designed and analyzed using Finite Element Method. In this paper, we introduce a novel Curved cone corrugated ground plane conical antenna for ultra-wideband (UWB) applications. The antenna is composed of curved cone with ... Read More
A 3D finite element model (FEM) of the PEMC sensor was developed to characterize the modes of vibration that have demonstrated high sensitivity to mass-change in experimentally fabricated sensors. The fundamental bending mode of vibration and the 1st bending harmonic are predicted at 10 ... Read More
The plasma enhanced chemical vapor deposition process with a linear plasma source and the frequency range up to 140 MHz developed by Dresden University of Technology and FAP GmbH Dresden enables a fabrication of thin film silicon layers at very high deposition rates. However, an increase ... Read More
Many materials require functionally graded cellular microstructures whose porosity is engineered to meet specific requirements of diverse applications. It has been shown in previous work that the bubble growth rate of a polymeric foam can be influenced by the surrounding acoustic ... Read More
Loudspeaker simulation is used to inform the designer as to the performance of a design. In recent years the Finite Element Method (FEM) has been used to model the mechanical and acoustical attributes of a loudspeaker with varying success. This paper shows how a model that incorporates ... Read More
A scheme for inductive wireless powering and readout of passive LC sensor is presented. The sensor’s inductor is designed as a planar square coil and is used as the power receiving component. The capacitor is connected directly to the inductor and it was designed as an interdigital ... Read More
We consider a 3D boundary value problem arising in electrostatics. The potential is stimulated by current sources placed on a cross-section S of the domain. In many applications it is sufficient to know the potential in S. So, one is interested in an appropriate 2D model taking into ... Read More