See How Multiphysics Simulation Is Used in Research and Development
Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.
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Metacomposites are new class of materials with unusual properties that can be engineered using existing materials with usual properties. The unusual properties of metacomposites are derived from the structure, analogues to atomic arrangement in crystal lattice. These material exhibits ... Read More
Introduction The electrical properties of materials are important in many different applications. In microelectronics for example, films must perform as insulators, semiconductor or as conducting layers. In recent years, scanning probe methods are being extended to the nanometre scale ... Read More
Numerical simulation can be advantageously employed to predict the main cell features (e.g., the reaction rate distribution on the electrodes, the cell voltage, or the electrolyte temperature) in order to optimize the design and operational conditions of the process. In this poster, we ... Read More
We report an implementation of parallel computing on Amazon Web Services™ (AWS) for touch-sensor modeling. COMSOL Multiphysics® was used to simulate an electromagnetic field distribution in a capacitive sensor assembly. Multiple COMSOL jobs were deployed on separate AWS instances and ... Read More
Microgrippers are typical MEMS devices used to pick, hold and transport micro-objects. Microgrippers are widely used in the field of micro-assembly, micro-surgery and manipulation of micro-particles. Thermal microgrippers are widely used for large displacement, high accuracy and ... Read More
This paper describes the design and characterization of an 8 slots resonant cavity Magnetron, which undergoes thermal-structural effects due to cathode heating. The proposed study involves Thermal Stress, Eigen-frequency and Particle Tracing analysis based on COMSOL Multiphysics®. ... Read More
In this paper, the effects of roughness in the surfaces of the plates caused due to nonuniform etching during their release and/or due to defects in the original wafer on the capacitance in RF-MEMS parallel plate varactors are analyzed. Capacitance extraction due to surface roughness has ... Read More
The variability of the design parameters caused by material properties like thermal conductivity is the major challenge in Micro Electromechanical System (MEMS). In resonator design the basic problem is that the frequency changes with temperature variation and quantitative explanation ... Read More
For PE insulated cables both the temperature difference ?T and the electric field coefficient ? have a significant influence on the electric field distribution because PE has a nonlinear electric conductivity which is approximately a function of the temperature and the electric field ... Read More
We consider a 3D boundary value problem arising in electrostatics. The potential is stimulated by current sources placed on a cross-section S of the domain. In many applications it is sufficient to know the potential in S. So, one is interested in an appropriate 2D model taking into ... Read More