See How Modeling and Simulation Is Used Across Industries
Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.
Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.
View the COMSOL Conference 2025 Collection
The intestine, a muscular, tubular organ within the digestive system is responsible for the final stages of food processing. The cyclic material transport generates a shear stress on the intestinal lining known as epithelium. Recently, the application of shear stress on epithelial cells ... Read More
Microfluidics and Biosensors are two principal fields that paved the way for the inception of Lab-on-a-chip (LOC) which provides early and cost-effective disease detection, from monitoring to treatment. LOC is a device that uses very small amounts of fluid on a microchip to do certain ... Read More
Nondestructive inspection (NDI) of damages (e.g., imperfect or degraded bonding lines) or the remaining strength of adhesively bonded lap joints is critical for the operational safety of aircrafts and vehicles. It remains a challenge to use the conventional NDI to quantitatively infer ... Read More
Porous guided bone regeneration (GBR) meshes are used in dentistry as a mechanical barrier to separate and protect the area of bone loss, providing space for new bone growth. An appropriate pore size can play a role, as important as its space-maintaining properties. The characteristics ... Read More
Baking is a central production step in the industrial production of edible wafers and waffles. The initially liquid batter is heated with a pair of metallic baking plates. Establishing a uniform and accurate temperature at the baking face (inner baking plate surface) is crucial for ... Read More
Structural Supercapacitors (SSC) are an important group of Multifunctional Energy Storage Composites (MESC) and can potentially play a significant role in lightweight design of aerospace and automotive applications [1]. Therefore, it is important to build accurate models based on the ... Read More
In this paper, we present a study of the simulation of Directed Energy Deposition (DED) Additive Manufacturing (AM) using a multiphysics approach. We use a combination of Heat Transfer in Fluids, Solid Mechanics and Laminar Flow physics to accurately simulate the DED process. The ... Read More
In this simulation, we aim to comprehend the origin and mechanism of the warpage phenomenon in patterned silicon wafers, which are key components in the field of microelectronics. This issue can become more pronounced in the presence of high global density of the patterns and can lead to ... Read More
Nowadays, designing ever more efficient power modules requires complex materials and more innovative methodologies. To significantly reduce the lead time of the devices and decrease the costs, especially during the prototyping and the testing phases, a Finite Element Analysis (FEA) can ... Read More
The semiconductor industry is always looking for early anticipation of manufacturing risk, pushing the development of Computer Aided Engineering (CAE) modeling of processes. Robust Chip-Package Interaction requires a deep understanding of thermo-mechanical stresses imposed during the ... Read More