May 16, 2024 11:00 a.m.–4:00 p.m. EDT

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See what is possible with multiphysics modeling

Microelectromechanical systems (MEMS) components including sensors, actuators, and resonators are found in the products we use daily — such as smartphones, vehicles, navigation systems, and healthcare monitoring systems. Successful MEMS design requires understanding the interactions between various physics at the microscale. This means that multiphysics analysis is critical for the development and optimization of MEMS devices. The COMSOL Multiphysics® software and its dedicated add-on products provide unique capabilities for simulation that captures the electromagnetic–structure, piezoelectric, thermal–structure, and other multiphysics interactions that affect MEMS designs.

Join us at this COMSOL Day to learn how leading organizations are using COMSOL Multiphysics® simulation to develop the next generation of MEMS devices, including gyroscopes, accelerometers, piezoelectric actuators, and micromechanical RF filters.


11:00 a.m.

Modeling and simulation (M&S) of MEMS devices requires software that can account for the wide range of physical phenomena that occurs at the microscale, including electrostatic, mechanical, piezoelectric, and electrothermal effects as well as fluid–structure interaction. The COMSOL Multiphysics® software is uniquely equipped for performing analyses across this full spectrum of phenomena essential at the microscale.

Attend this session to get an overview of how COMSOL Multiphysics® is used in MEMS device simulations. The session will also highlight how COMSOL Compiler™ is leveraged to create custom standalone simulation apps and digital twins, making them accessible to everyone involved in the design and manufacturing processes.

11:20 a.m.
Keynote Talk
Developing Better Bolometers: Optical, Thermoelectric, and Mechanical Modeling Tools

Marin Sigurdson, Teledyne

Uncooled thermal cameras are based on arrays of microbolometer pixels. These MEMS devices, grown directly on the readout IC, are designed with specific optical, thermal, mechanical, and electrical properties for specific camera performance. Teledyne is developing a suite of 3D modeling tools using the COMSOL® software to predict bolometer performance and manufacturability as well as reduce the design cycle time for improved microbolometers. In the new process for developing bolometers, Teledyne starts with an optical solver to predict the spectral absorption of the 3D pixel with specific material layers. Then, in a transient electrothermal model, the absorbed radiation heats the pixel, resulting in a rise in the resistance of the thermistor material. A bias pulse is applied across the thermistor, and the resulting current is interrogated — from which responsivity can be calculated. Finally, a mechanical model predicts pixel deformation based on intrinsic stress of the constituent layers.

This keynote talk will cover Teledyne’s modeling efforts to improve pixel responsivity by tweaking materials and geometry.

11:40 a.m.
11:50 a.m.

Piezoelectric and piezoresistive devices, including sensors, valves, pumps, and harvesters, depend on various combinations of physics. COMSOL Multiphysics® is an ideal platform for simulating these types of devices due to its capabilities for modeling piezoelectric effects as well as phenomena important to the functionality of these devices, such as thermal–structure and fluid–structure interactions.

Attend this session to learn about the comprehensive capabilities across the COMSOL product suite for modeling piezoelectric and other smart material devices. Moreover, this presentation will provide a brief overview of modeling advanced multiphysics effects like pyroelectricity, electrostriction, and magnetostriction.

12:20 p.m.
12:35 p.m.

Modeling and simulation has become an important tool for the design of piezoelectric and electrostatic MEMS resonators. These resonators are fundamental to a wide array of everyday devices and systems, such as handheld devices and telecom equipment.

COMSOL Multiphysics® is extensively used in the analysis of various resonator types: film bulk acoustic (FBAR), solidly mounted (SMR), surface acoustic wave (SAW), Lamb wave, and quartz resonators. In addition, the software is also used for the simulation of capacitively actuated silicon resonators, including Lamé mode resonators.

Join us in this session to get an overview of the capabilities of the MEMS Module for modeling of MEMS resonators. We will describe various analysis methods available in the module, such as frequency-response, eigenfrequency, and prestressed methods, along with different modes of damping, including thermoelastic damping, anchor damping, and thin-film damping. You will learn how these methods of analysis and damping modes can be used to gain a detailed understanding of resonator behavior and performance.

1:05 p.m.
1:20 p.m.

Tech Lunches are informal sessions where you can interact with COMSOL staff and other attendees. You will be able to discuss any modeling-related topic that you like and have the opportunity to ask COMSOL technology product managers and applications engineers your questions. Join us!

1:50 p.m.
Keynote Talk
Cost and Time Savings Benefits of Using COMSOL Multiphysics for Audio Product Development

Michael Ricci, xMEMS

This talk will highlight a use case for developing a piezo-MEMS array for a desktop speaker application. Project stage gates will be covered, from concept validation and design evaluation to product ID acoustic simulations and marketing collateral creation. COMSOL simulations showing the free-air dispersion characteristics of the piezo-MEMS array will be shown. Ricci will explain how achieving correlated results between these models and physical products saves time and money, lowers risk, and establishes confidence. He will also discuss another key benefit of using COMSOL Multiphysics®: the collaboration opportunities created between stakeholders. He will explain how cross-functional team collaboration can shorten development cycles by limiting design iterations, which accelerates decision making and time to market. In his closing comments, Ricci will share how the add-on modules to COMSOL Multiphysics® for modeling acoustics have matured in recent years, with a special mention about the value of the Application Libraries and the growing number of transducer models being added.

2:10 p.m.
2:20 p.m.

When devices have geometric details with dimensions close to those of the thermal and viscous boundary layers, it becomes important to consider thermoviscous losses.

Thermoviscous losses are especially pronounced in structures with submillimeter features where acoustic propagation occurs, such as in components of handheld devices, loudspeaker grilles, earbuds, hearing aids, MEMS transducers, and perforates used in mufflers and for sound insulation.

With COMSOL Multiphysics® and the Acoustics Module, you can easily model such devices by utilizing the software's built-in features for modeling thermoviscous losses. For multiphysics simulations, the losses can be included in vibroacoustic settings or transducer models, where electromechanical forces can be coupled. Furthermore, the software includes a dedicated acoustic slip-flow formulation, and integrated solutions are available for combining with and coupling to lumped electroacoustic representations.

In this session, you will learn modeling techniques for capturing thermoviscous effects, including how to set up relevant multiphysics models. You will also get an introduction to modeling microacoustics systems that include nonlinear effects.

2:50 p.m.
3:05 p.m.

COMSOL Multiphysics® includes a wide range of features for analyzing both piezoelectric and electrostatic inertial sensors, which makes the software well suited for simulation-driven design of gyroscopes and accelerometers.

For the modeling of capacitive devices, COMSOL Multiphysics® offers comprehensive built-in functionality for bidirectionally coupled electrostatics and mechanical analysis, including features for prestressing the device with a bias voltage before applying a harmonic voltage. This functionality is based on first principles and can be used for modeling of any type of MEMS structure.

Join us in this session to get an overview of the capabilities in COMSOL Multiphysics® for modeling gyroscopes, accelerometers and MEMS devices with capacitive transduction, such as electrostatic pressure sensors.

3:35 p.m.
3:50 p.m.

COMSOL Multiphysics® is extensively used for microfluidics simulation in various industrial sectors, such as healthcare and biotechnology, consumer electronics, and environmental monitoring. The software is well suited for the analysis of microfluidic devices, as it can account for the multiphysics effects that are often found in such devices, including fluid–structure, electromechanical, and electrothermal interactions as well as piezoelectricity, electrokinetics, and chemical reactions.

Attend this session to get an overview of how microfluidics modeling and simulation can be applied to micropumps, BioMEMS, inkjet technology, gas sensors, and more. You will learn how multiphysics analysis is used for understanding, developing, and optimizing microfluidic devices.

4:20 p.m.
4:35 p.m.
Closing Remarks

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COMSOL Day Details

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May 16, 2024 | 11:00 a.m. EDT (UTC-04:00)
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Invited Speakers

Marin Sigurdson Teledyne FLIR

Marin Sigurdson is a scientist at Teledyne FLIR in Santa Barbara, CA, where she uses COMSOL Multiphysics® to model the performance and yield of microbolometers for infrared cameras. Before FLIR, she worked in MEMS modeling at Innovative Micro Technologies, and in microfluidics at UC Santa Barbara. She received her PhD in mechanical engineering from UCSB in 2008.

Michael Ricci xMEMS

Michael Ricci has more than 30 years of experience working in the semiconductor industry, with a special focus on MEMS transducers. He has been a user of the COMSOL Multiphysics® software since 2014. Ricci joined xMEMS in 2020 as senior director of electroacoustic engineering. In this role, he has contributed to the development and launch of piezo-MEMS µspeakers, built xHQ electroacoustic test facilities, trained the FAE team, and furthered the adoption of piezo-MEMS transducers at technical conferences and events. Prior to working at xMEMS, Ricci was a principal electroacoustics engineer at Knowles Electronics and a senior field application engineer at Bosch Sensortec, supporting SiSonic™ and Akustica MEMS microphone integrations and audio testing for strategic accounts, respectively. Ricci is also a voting member of the Acoustical Society TAG S1 and S21 standards working groups.