Stress-Optical Effects with Generalized Plane Strain
Application ID: 190
Planar photonic waveguides in silica (SiO2) have great potential for use in wavelength routing applications. The major problem with this type of waveguide is birefringence. Anisotropic refractive indices result in fundamental mode splitting and pulse broadening. The goal is to minimize birefringence effects by adapting materials and manufacturing processes. One source of birefringence is the use of a silicon (Si) wafer as the substrate onto which the waveguide structure is deposited.
After annealing at high temperatures, a mismatch in thermal expansion between the silica and silicon layers results in thermally induced stresses in the structure at the operating temperature (typically room temperature).
This model is included as an example in the following products:Structural Mechanics Module Wave Optics Module
however additional products may be needed to reproduce it. This example may be created and run using components from the following product combinations:
- COMSOL Multiphysics® and
- Wave Optics Module and
- either the MEMS Module, or Structural Mechanics Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.