Viscoplastic Creep in Solder Joints
Application ID: 4488
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations.
The geometry includes two electronic components (chips) mounted on a circuit board by means of several solder ball joints. Significant plastic flow appears after about 40 s of thermal loading.
This application was built using the following:Nonlinear Structural Materials Module
The combination of COMSOL® products required to model your application depends on the physics interfaces that define it. Particular physics interfaces may be common to several products (see the Specification Chart for more details). To determine the right combination of products for your project, you should evaluate all of your needs in light of each product's capabilities, consultation with the COMSOL Sales and Support teams, and the use of an evaluation license.