The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
This app demonstrates the following: Geometry parts and parameterized geometries Sending an email with a report when the computation is finished User-defined email server settings which is useful when running compiled standalone applications Options for setting different mesh sizes ... Read More
This app demonstrates the following: Geometry parts and parameterized geometry A results table form object containing outputs Finned pipes are used for coolers, heaters, or heat exchangers to increase heat transfer. They come in different sizes and designs depending on the ... Read More
Chemical engineering students can model a nonideal tubular reactor, including radial and axial variations in temperature and composition, and investigate the impact of different operating conditions with this easy-to-use app. The process described by the Tubular Reactor with ... Read More
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... Read More
Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, ... Read More
This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using ... Read More
This model is intended as a first introduction to simulations of fluid flow and conjugate heat transfer. It shows you how to: Draw an air box around a device in order to model convective cooling in this box, set a total heat flux on a boundary using automatic area computation, and ... Read More
This study simulates the thermal behavior of a computer Power Supply Unit (PSU). Most of such electronic enclosures include cooling devices to avoid electronic components to be damaged by excessively high temperatures. In this model, an extracting fan and a perforated grille cause an air ... Read More
These models use the Discrete Ordinates method (DOM) and P1 approximation to solve a 3D radiative transfer problem in an emitting, absorbing, and linear-anisotropic scattering finite cylindrical medium. Using the S6 quadrature of DOM leads to accurate results, which are needed in ... Read More
This example reproduces parts of the study of Ref. 1 on the thermal contact resistance at the interface between a heat sink and an electronic package. Eight cooling fins equip the cylindrical heat sink and contact is made at the radial boundaries of the package. The efficiency of the ... Read More