The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
Diffusion-Controlled Dendrite Formation Using the Level Set Method
The present model demonstrates diffusion-controlled electrodeposition of copper on microstructured band electrode arrays (MEA). Mass transport by Fickian diffusion of copper ions is solved using the Transport of Diluted Species interface. Dendrite formation as a consequence of diffusion ... Read More
A Two Phase Model For A Five Layer PEM Fuel Cell MEA
A low temperature PEM fuel cell produces water on the cathode side, and for higher currents liquid water will form in the porous layers and in the flow field The presence of liquid water has a large impact on the humidification of the ion-conducting polymer electrolyte, the transport of ... Read More
Copper Deposition in a Trench Using the Level Set Method
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... Read More
Electroplating of Multiple Components in a Rack
When several components are to be electroplated they are typically mounted on a rack in the electroplating bath. An important aspect is then achieving a uniform thickness of the plated layer for all components mounted on the rack. This example model allows for investigating the effect ... Read More
Decorative Plating
Tutorial model of electroplating. The model uses secondary current distribution with full Butler-Volmer kinetics for both anode and cathode. The thickness of the deposited layer at the cathode is computed as well as the pattern caused by dissolution of the anode surface. Read More
Aluminum Anodization
When anodizing aluminum, the surface is electrochemically altered to form an abrasive and corrosion-resistive Al2O3 film. The electrode kinetics during the process are only marginally affected as the oxide layer grows, so a stationary analysis of the current distribution is sufficient to ... Read More
Secondary Current Distribution in a Zinc Electrowinning Cell
This is a model of the secondary current distribution in a zinc electrowinning cell. The model investigates the impact on the current distribution when changing the electrode alignment in a parametric study. The geometry is in 2D. Read More
Ion-Exchange Membranes and Donnan Potentials
This model file was used for creating the plots featured in the blog post "How to Model Ion-Exchange Membranes and Donnan Potentials". Read More
Electroplating of a Printed Circuit Board
This example simulates electroplating of a printed circuit board (PCB) in 3D using the Secondary Current Distribution interface. In order to achieve thickness uniformity across the PCB, a dummy pattern is included in the design, along with an aperture in the electroplating bath. Read More
Pulse Reverse Plating
This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal ... Read More