Electroplating of a Printed Circuit Board

Application ID: 20331

This example simulates electroplating of a printed circuit board (PCB) in 3D using the Secondary Current Distribution interface. In order to achieve thickness uniformity across the PCB, a dummy pattern is included in the design, along with an aperture in the electroplating bath.

This model example illustrates applications of this type that would nominally be built using the following products: