The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
This model simulates an LED that emits in the infrared part of the electromagnetic spectrum. The device structure is made up of a single p-n junction formed by a layer of p-type doping near the top surface of an otherwise n-type wafer. This kind of device geometry is simple and cheap to ... Read More
When anodizing aluminum, the surface is electrochemically altered to form an abrasive and corrosion-resistive Al2O3 film. The electrode kinetics during the process are only marginally affected as the oxide layer grows, so a stationary analysis of the current distribution is sufficient to ... Read More
This example was originally formulated by Albert Witarsa under Professor Bruce Finlayson’s supervision at the University of Washington in Seattle. It was part of a graduate course in which the assignment consisted of evaluating the potential of patents in the field of microfluidics ... Read More
Passive devices can be designed using lumped element features if both the operating frequency of the device and the insertion loss of lumped elements are low. This example simulates two types of lumped element filters that are similar to lumped ports, except that they are strictly ... Read More
This model shows how to combine different types of material nonlinearity, such as creep and elastoplasticity. In this specific example you will perform a stress and nonlinear strain analysis on a thick cylinder under a nonproportional loading: an initial temperature increase followed by ... Read More
This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal ... Read More
Surface plasmon-based circuits are being used in applications such as plasmonic chips, light generation, and nanolithography. The Plasmonic Wire Grating Analyzer application computes the coefficients of refraction, specular reflection, and first-order diffraction as functions of the ... Read More
Marangoni convection occurs when the surface tension of an interface (generally liquid-air) depends on the concentration of a species or on the temperature distribution. In the case of temperature dependence, the Marangoni effect is also called thermo-capillary convection. The Marangoni ... Read More
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... Read More
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... Read More