Copper Deposition in a Trench using the Level Set Method
Application ID: 48781
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library.
The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, the original model cannot be extended to simulate deposition after cavity formation.
In the present model, the Level Set interface is used instead of the Deformed Geometry interface to simulate depostion also after the cavity has formed. The electrode kinetics at the deposition boundary is defined as a domain term making use of the delta function from the Level Set interface. The model results obtained from the level set formulation before the cavity has formed match well with the original model.
This model example illustrates applications of this type that would nominally be built using the following products:Electrodeposition Module
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® and
- CFD Module, or Microfluidics Module and
- Batteries & Fuel Cells Module, Corrosion Module, Electrochemistry Module, or Electrodeposition Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.