The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
This example studies a narrow vertical cylinder placed on top of a reservoir filled with water. Because of wall adhesion and surface tension at the air/water interface, water rises through the channel. Surface tension and wall adhesive forces are often used to transport fluid through ... Read More
This model treats the free convection of argon gas within a light bulb. It shows the coupling of heat transport (conduction, radiation and convection) to momentum transport (non-isothermal flow) induced by density variations caused by temperature. COMSOL Multiphysics model makes it ... Read More
This model describes the three heat transfer modes: conduction, convection, and radiation, combined with nonisothermal flow in a realistic geometry representing a light bulb and the surrounding air. The LED chips dissipate heat. The model computes the equilibrium temperature induced by ... Read More
A homopolar generator is composed of an electrically conductive rotating disc placed in a uniform magnetic field that is perpendicular to the plane of rotation. The motion of the conductor through the static magnetic field induces Lorentz currents in the disc. By connecting the outside ... Read More
Using a Fluid-Solid Interaction multiphysics interface, the behavior of a spring-loaded ball check valve is studied under varying functional and reverse flow. The fluid force acting on the ball opens the valve at the opening pressure. In the case of a reversed pressure, the ball comes ... Read More
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... Read More
Droplet evaporation is ubiquitous in everyday life, and is essential in many industrial processes such as ink-jet printing, cleaning or coating of surfaces, and phase change heat transfer. In this model, a water droplet placed on a solid substrate evaporates in air. We solve the ... Read More
This model illustrates how to implement a multiphysics contact. It models the thermal and electrical behavior of two contacting parts of a switch. The electrical current and the heat flow from one part to the other only through the contact surface. The contact switch device has a ... Read More
Chemical vapor deposition (CVD) is an important step in the process of manufacturing microchips. One common application is the deposition of silicon on wafers in low pressure reactors to obtain uniform deposition thicknesses. This example models the coupled reaction kinetics, fluid ... Read More
This model shows how to compute an array of borehole heat exchangers (BHEs) for shallow geothermal energy production. The BHEs are simplified as line heat sinks with a uniform heat extraction rate. The array is embedded into a layered subsurface model with groundwater flow in one of the ... Read More