The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
This tutorial models a DC glow discharge by solving fluid-type plasma equations fully coupled with the homogeneous and time-independent electron Boltzmann equation in the classical two-term approximation. The approximated Boltzmann equation is solved for each position of space and is ... Read More
This example models the desalination of water by capacitive deionization in a "flow-between" cell (fbCDI). The model geometry is in 2D. Steady Brinkman flow, a tertiary current distribution, and the improved modified Donnan description of the deionization process is assumed. Read More
The incompressible boundary layer on a flat plate in the absence of a pressure gradient is usually referred to as the Blasius boundary layer. The steady, laminar boundary layer developing downstream of the leading edge eventually becomes unstable to Tollmien-Schlichting waves and finally ... Read More
This model demonstrates how to setup a Time Domain to Frequency FFT study for a distributed Bragg reflector (DBR) structure. The results agree well with the results of a regular Frequency domain study. Read More
This example shows a 2D steady-state thermal analysis including convection to a prescribed external (ambient) temperature. It is given as a benchmarking example. The benchmark result for the target location is a temperature of 18.25 C. The COMSOL Multiphysics model, using a default mesh ... Read More
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Read More
The GEC cell was introduced by NIST in order to provide a standardized platform for experimental and modeling studies of discharges in different laboratories. The plasma is sustained via inductive heating. The Reference Cell operates as an inductively-coupled plasma in this model. This ... Read More
The Yagi–Uda antenna is designed for a specific Wi-Fi band and can reduce eavesdropping by directing signals with the help of directors. This antenna consists of one uniformly spaced reflector and four directors. Simulated results show a maximum 10 dBi gain and a front-to-back ratio of ... Read More
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... Read More
This model simulates an LED that emits in the infrared part of the electromagnetic spectrum. The device structure is made up of a single p-n junction formed by a layer of p-type doping near the top surface of an otherwise n-type wafer. This kind of device geometry is simple and cheap to ... Read More
