The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
In this example, phase transformation data and phase material properties are imported from JMatPro, and used to compute CCT curves. Dilatometry curves (axial thermal strain) are computed across a range of cooling rates. Read More
A 3D model is used to simulate the cooling of a bevel gear from an austenitic state. Phase material properties and phase transformation data are imported into the model. The final phase composition and the residual stress state are computed. Phenomena such as thermal strains, phase ... Read More
This model analyzes the operation of a micromirror in air and the effects of thermoviscous damping on the vibration response. The model includes thermal losses in the structure as well as thermoviscous acoustic phenomena. The model couples the Thermoelasticity multiphysics interface to ... Read More
This model serves the purpose of validation and verification of the Linear Elastic Material, Layered model in the Shell interface. In COMSOL Multiphysics, composites are analyzed either based on Layerwise 3D elasticity theory through the Layered Shell interface or based on FSDT-ESL ... Read More
This model demonstrates how to set up a phase field damage multiphysics model to predict crack propagation in thermoelastic solids under large deformations. The crack-driving force depends on the principal stresses, which in turn depend on the temperature distribution in the solid ... Read More
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Read More
In massive forming processes like rolling or extrusion, metal alloys are deformed in a hot solid state with material flowing under ideally plastic conditions. Such processes can be simulated effectively using computational fluid dynamics, where the material is considered as a fluid with ... Read More
This model demonstrates an integrated structural-thermal-optical performance (STOP) analysis of an optical system. The Petzval Lens tutoral is used as the basis for this model, together with a simple barrel geometry The isothermal model performs a Parametric Sweep over several uniform ... Read More
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... Read More
The following example solves a pure conduction and a free-convection problem in which a vacuum flask holding hot coffee dissipates thermal energy. The main interest is to calculate the flask's cooling power; that is, how much heat it loses per unit time. This tutorial model treats the ... Read More