The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
Search for tutorials and apps relevant to your area of expertise via the Quick Search feature. Note that many of the examples featured here can also be accessed via the Application Libraries that are built into the COMSOL Multiphysics® software and available from the File menu.
Interfacial failure by delamination or debonding can be simulated with a Cohesive Zone Model (CZM). This example shows the implementation of a CZM with a bilinear traction-separation law. It is used to predict the mixed-mode softening onset and delamination propagation in a composite ... Read More
This is a conceptual model illustrating how to couple fluid-structure interaction, heat transfer, and thermal expansion. A bimetallic strip in an air channel is heated so that it bends. After some time, an airflow with an inlet temperature which varies in time is introduced. As a ... Read More
This model shows how to use the scattered field formulation to compute the transmission coefficient for impinging P and S plane elastic waves onto a finite size phononic crystal. The transmission tends to zero in the frequency range corresponding to P- and S-wave band gaps, as ... Read More
This is a tutorial example, showing how to work with pretensioned bolts. Various aspects of bolt modeling are explored: Modeling bolts as solids or by beams Connections of beams to solid components Bolts ended by nuts or by internal threads in the attached component Import of bolt and ... Read More
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Read More
The Highly Accelerated Stress Test (HAST) is a testing technique to precipitate failure of electronic devices under elevated temperature and high humidity environment. This model demonstrates the structural analysis of a plastic encapsulated IGBT module under the HAST testing condition. ... Read More
This example explores the shift in natural frequencies caused by changing the temperature. One study investigates a doubly clamped beam where both ends are fixed, while the other study looks at a cantilever beam where only one end is fixed. The following effects are studied: Stress ... Read More
In his example, the lowest natural frequency of a 3D bracket are maximized using shape optimization. Read More
Solid-state batteries (SSB) are a promising technology that could suffer from internal mechanical stresses due to the growth and shrinkage of the electrodes within all-solid components. With this model, the charge-discharge cycling of an SSB is simulated with a focus on the interaction ... Read More
In this example of a peristaltic pump, rollers squeeze a flexible tube and the compression drives a fluid through the tube. The model demonstrates how to use the Fluid-Structure Interaction interface. The main advantage of the peristaltic pump is that no seals, valves or other internal ... Read More
