Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Simulations of MEMS Based Piezoresistive Accelerometer Designs in COMSOL

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Taiwan, (R.O.C)
[2]National Tsing Hua University, Taiwan, (R.O.C)

Different configurations of MEMS based accelerometer has been made and analysed using COMSOL Multiphysics. The designs presented in this paper consist of a square shaped proof mass with flexures supporting it. Different position and varied number of supporting flexures attached to the proof mass makes each configuration distinct. The piezoresistors are placed near the proof mass and frame ends ...

Power Transistor Heat Sink Design Trade-offs

T. Eppes, I. Milanovic, and G. Quarshie
University of Hartford
West Hartford, CT

Power transistors require heat sinks to dissipate thermal energy and keep junction temperatures below the recommended limit. The reliability and longevity of any semiconductor device is inversely proportional to the junction temperature. Hence, a significant increase in reliability and component life can be achieved by a small reduction in operating temperature. A range of heat sink designs ...

Optimization of Design Parameters of a Novel MEMS Strain Sensor used for Structural Health Monitoring of Highway Bridges

H. Saboonchi, and D. Ozevin
Civil Engineering Department
University of Illinois at Chicago
Chicago, IL

The novel Micro Electro Mechanical System (MEMS) based Piezoresistive stain sensor is presented in this paper. The main goal of this sensor is to monitor the localized strain in the highway bridges especially near the crack tips. Monitoring the crack growth on the bridges can lead to early detection and prevention of bridge failures. The COMSOL Multiphysics software was used to optimize the ...

Simulation of Cyclic Voltammetry of Ferrocyanide/Ferricyanide Redox Reaction in the EQCM Sensor

H. Kwon, and E. Akyiano
Dept. of Engineering and Computer Science
Andrews University
Berrien Springs, MI

In this paper, the cyclic voltammetry behavior of Ferrocyanide/Ferricyanide, which is commonly used for electrochemical DNA detection experiment, was studied in the commercial EQCM-D setup (Q-sense) using the COMSOL Multiphysics. The model was established in a 3D geometry of QCM liquid cell. The simulation shows depletion of concentration of ferrocyanice following applied electrode ...

Modeling of Microwave Heating of a Rotating Object in a Domestic Oven in COMSOL Multiphysics

J. Raj[1], S. Birla[2], K. Pitchai[3], J. Subbiah[2], and D. Jones[2]
[1]Indian Institute of Crop Processing Technology, Thanjavur, Tamil Nadu, India
[2]Dept. of Biological Systems Engineering, University of Nebraska Lincoln, Lincoln, NE
[3]Dept. of Food-Science, University of Nebraska Lincoln, Lincoln, NE

Domestic microwave ovens are notorious for their uneven heating of food materials. This is caused by a varying electromagnetic field whose variation is caused by a number of factors dependent on the oven and the food parameters. Experimental validation of heating would therefore give highly variable results and would be labour, resource and time intensive. Thus modeling of the microwave ...

Simulating Performance and Species Crossover in a Vanadium Redox Flow Battery using COMSOL Multiphysics

E. Agar, K. Knehr, C. Dennison, and E. Kumbur
Electrochemical Energy Systems Lab.
Dept. of Mechanical Eng. and Mechanics
Drexel University
Philadelphia, PA

Vanadium redox flow batteries (VRBs) are a promising new energy storage technology designed for use in long term applications such as uninterruptible power supply and coupling with renewable energy sources (i.e. wind and solar). Crossover is the undesired transport of vanadium ions through the ion exchange membrane during operation and is a major factor limiting the overall efficiency and charge ...

FEM Analysis of Laser-Induced Heating of Gold Nanoparticles

D. Gonzalez[1], J. Gardner[1], and O. Tigli[2]
[1]Biomedical Engineering, University of Miami, Coral Gables, FL,
[2]Electrical and Computer Engineering, University of Miami, Coral Gables, FL

Nanoparticles are being extensively researched as a noninvasive method for selectively targeting and killing cancer cells. In this study, we model the thermal activation of gold nanospheres and nanorods in a fluidic environment to determine the thermal response of the surrounding medium.

Design of Cooling System for Electronic Devices Using Impinging Jets

P. Lin[1], C. Chang[2], H. Huang[3], and B. Zheng[4]
[1]Mechanical and Aerospace Eng., Rutgers, The State University of New Jersey, Piscataway, NJ
[2]FTR Systems (Shanghai) Inc., Shanghai, China
[3]PolarOnyx, Inc., San Jose, CA
[4]School of Mechatronics Eng., University of Electronic Science and Technology of China, Chengdu, China

The heat sink designs using impinging liquid jets, which form stagnation flows, feature uniform heat transfer coefficients, and provide thin thermal boundary layers, are studied to reduce the heat from GPUs. Three different designs using central, micro, and uniform-cross-section (UCS) central jets are studied and simulated in COMSOL. The efficiency factors, defined as the ratio of total ...

The Transient Modeling of Single-Bubble Nucleate Boiling in a Sub-Cooled Liquid Using an ALE Moving Mesh

C. J. Forster, and M. K. Smith
Georgia Institute of Technology
Athens, GA

This paper investigates the evolution of a single bubble going through growth, pinch-off, and condensation while rising due to buoyancy forces in a sub-cooled liquid. Phase change is modeled on the evolving liquid-vapor interface by considering changes in enthalpy and heat fluxes at the interface. A comparison of the ALE model is made with the same single-bubble system computed with a level ...

Finite Element Analysis of Integrated Circuit Interconnect Lines on Lossy Silicon Substrate

S. Musa[1], M. Sadiku[1], and A. Emam[2]

[1]Roy G. Perry College of Engineering, Prairie View A&M University, Prairie View, TX
[2]Information Systems Department, King Saud University, Riyadh, Saudi Arabia

The silicon substrate has a significant effect on the inductance parameter of a lossy interconnect line on an integrated circuit. It is essential to take this into account in determining the transmission line electrical parameters. In this paper, a new quasi-TEM capacitance and inductance analysis of multiconductor multilayer interconnects is successfully demonstrated using the finite element ...