See How Multiphysics Simulation Is Used in Research and Development
White Papers and Application Notes
Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.
View the COMSOL Conference 2018 Collection
Simulation of Cyclic Voltammetry of Ferrocyanide/Ferricyanide Redox Reaction in the EQCM Sensor
In this paper, the cyclic voltammetry behavior of Ferrocyanide/Ferricyanide, which is commonly used for electrochemical DNA detection experiment, was studied in the commercial EQCM-D setup (Q-sense) using the COMSOL Multiphysics. The model was established in a 3D geometry of QCM ... Read More
Power Transistor Heat Sink Design Trade-offs
Power transistors require heat sinks to dissipate thermal energy and keep junction temperatures below the recommended limit. The reliability and longevity of any semiconductor device is inversely proportional to the junction temperature. Hence, a significant increase in reliability and ... Read More
Simulations of MEMS Based Piezoresistive Accelerometer Designs in COMSOL
Different configurations of MEMS based accelerometer has been made and analysed using COMSOL Multiphysics. The designs presented in this paper consist of a square shaped proof mass with flexures supporting it. Different position and varied number of supporting flexures attached to the ... Read More
Double Pipe Heat Exchanger Modelling - COMSOL Uses in Undergraduate Education
A cornerstone of Chemical and Mechanical Engineering undergraduate programs the world over is the experimental and theoretical study of heat exchange. Graduating engineering students gain some appreciation in their lab course by comparing empirical correlations combined with the ... Read More
Design of Cooling System for Electronic Devices Using Impinging Jets
The heat sink designs using impinging liquid jets, which form stagnation flows, feature uniform heat transfer coefficients, and provide thin thermal boundary layers, are studied to reduce the heat from GPUs. Three different designs using central, micro, and uniform-cross-section (UCS) ... Read More
The Transient Modeling of Single-Bubble Nucleate Boiling in a Sub-Cooled Liquid Using an ALE Moving Mesh
This paper investigates the evolution of a single bubble going through growth, pinch-off, and condensation while rising due to buoyancy forces in a sub-cooled liquid. Phase change is modeled on the evolving liquid-vapor interface by considering changes in enthalpy and heat fluxes at the ... Read More
Modeling of Microwave Heating of a Rotating Object in a Domestic Oven in COMSOL Multiphysics
Domestic microwave ovens are notorious for their uneven heating of food materials. This is caused by a varying electromagnetic field whose variation is caused by a number of factors dependent on the oven and the food parameters. Experimental validation of heating would therefore give ... Read More
FEM Analysis of Laser-Induced Heating of Gold Nanoparticles
Nanoparticles are being extensively researched as a noninvasive method for selectively targeting and killing cancer cells. In this study, we model the thermal activation of gold nanospheres and nanorods in a fluidic environment to determine the thermal response of the surrounding medium. Read More
Deformation of Biconcave Red Blood Cell in the Dual-Beam Optical Tweezers
A biconcave-shaped Red Blood Cell was trapped and deformed in a dual-trap optical tweezers. The two highly focused trapping beams of Gaussian intensity distribution were modeled as background field in the COMSOL Radio Frequency Module. The 3D radiation stress distribution on the cell ... Read More
Modeling and Simulation of Artificial Core-Shell Based Nanodielectrics for Electrostatic Capacitors Applications
The need for high storage capacitors led to the development of polymer based capacitors. Polymers have high processability, mechanical flexibility, electrical breakdown strength and compatibility with printed circuit board (PCB) technologies; but usually have very low permittivity ... Read More