张春 , 朱铧丞 , Ashim Datta ,
引言：微波干燥过程涉及多物理场的耦合，物理过程十分复杂。不仅有被加热物质的形态改变，还有气态、液态和固态三相的相互作用。为了更清楚地理解微波干燥过程，本模型将电磁场、多相流和物理变形用相应的方程耦合到一起建模分析，并用相应的物理参数表征微波干燥过程。（图1） COMSOL Multiphysics® 的使用：借鉴微波加热接口土豆模型，添加气体和固体传热接口以及自定义方程，用方程和参数实现多物理场耦合。实验模型中，干燥物为土豆，且被视为多孔弹性介质。物质变形用相应的矩阵来表征。 结果：在仿真结果的基础上，利用家用微波炉干燥土豆，设计实验，并测量了微波干燥过程中的重要物理参数，如温度、水分和形变。（图2，图3） 结论：该仿真模型和实验基本吻合，较清晰地反应了微波干燥的复杂物理过程。
S. Kumar, and S. Panigrahi
 Agricultural and Food Engineering Department, Indian Institute of Technology Kharagpur, West Bengal, India
The novel concept of distributing the food super chilled (partially frozen) in order to prolong the shelf life has been suggested in the project. The temperature of the distribution chain is envisaged to be +5C. The suggested application has the following advantages: 1) Partial thawing of the product in the distribution chain makes it easier to handle. 2) The unhealthy and labour-demanding ...
D. Testi, P. Conti
University of Pisa, Department of Energy and Systems Engineering, Pisa, Italy
The use of foundation piles as ground heat exchangers coupled to a geothermal heat pump is considered of interest for possible savings in installation costs, compared to conventional borehole heat exchangers. We refer to them as “geothermal piles” or “energy piles”. The main purpose of the foundation structure is to transmit the load of the building to the lower layers of the soil, best suited ...
Boopathi S, Ms.E.Malar, Deepan Chakravarthi P
Department of Biomedical Engineering, PSG College of Technology, Coimbatore, Tamil Nadu, India
This paper deals with an integrated numerical and experimental analysis work aiming at the investigation of the thermal stress on nanowires in electronic gadgets especially computers and mobile phones. The comparative study of the nanowires are analyzed through the Thermal Stress physics using different variants such as Cu, Al, ZnO, Si(c), SiO2 which can be used in sensors, solar cells, LCD, ...
Modeling of Fluid Flow and Heat Transfer During a Steam-Thermolysis Process for Recycling Carbon Fiber Reinforced Polymer
A. Oliveira Nunes, Y. Soudais, R. Barna, A. Bounacer, Y. Yang
Centre RAPSODEE - Ecole des Mines d'Albi, Albi, France
Different types of technologies to recycle carbon fiber reinforced polymer (CFRP) waste have been studied, for example: pyrolysis, solvolysis and steam-thermolysis. The steam-thermolysis is a process that combines pyrolysis and superheated steam at atmospheric pressure to decompose the organic matrix of the composite. The waste is introduced into a bench-scale reactor heated at high temperatures ...
M. Dickinson[1,2], N. Renevier , J. Calderbank[2,3]
The Jost Institute, School of Computing, Engineering & Physical Sciences, University of Central Lancashire, Preston, UK
Racing to Research Team, School of Computing, Engineering & Physical Sciences, University of Central Lancashire, Preston, UK
School of Computing, Engineering & Physical Sciences, University of Central Lancashire, Preston, UK
Internal combustion engine components have been a main research interest over many decades. The structural mechanics and dynamics of the piston rings has been a large focus of work in order to gain a greater understanding of the how the piston ring dynamics affect the piston ring. Piston rings are often coated to reduce the level of wear on the ring as they will suffer substantial levels of ...
B. Noailles  , S. Meunier , V. Bruyere 
 RocTool, Savoie Technolac, Module R, France
 SIMTEC, France
In the molding industry, high productivity rate, low energy consumption, large 3D parts, and homogeneous temperature distribution are the main targets. The 3iTech® inductive technology developed by RocTool ensures both good temperature homogeneity and short heating time. Conventionally, to guarantee efficient cooling, a turbulent water flow is directly integrated into the mold. Ideally, to cope ...
唐旻 , 冯强强 , 董一琳 
近年来，三维系统级封装技术逐渐成为人们的关注焦点，是下一代集成电路封装设计最有发展潜力的实现方案。然而，热管理是系统级封装技术需解决的关键问题。图1是典型的系统级封装结构，包含堆叠芯片、硅通孔、封装基板、热界面材料以及多层凸点结构。若对该结构的所有细节进行建模，将会消耗巨大的计算资源，导致分析效率非常低下。因此，本论文将封装中的硅通孔层以及凸点层等复杂结构进行等效处理，提取它们在水平和垂直方向上的等效热导率以及等效比热容、等效密度等参数。例如，在建模过程中，采用 COMSOL Multiphysics® 传热模块对硅通孔层的水平方向等效热导率进行提取，边界设置如图2所示，通过仿真得到的热源端温度来推导等效热导率。类似地，垂直方向的等效热导率提取如图3所示。经过上述处理，可将封装中的硅通孔层以及凸点层等复杂结构等效为介质均匀的材料，然后再采用 COMSOL 进行整体封装结构的热仿真 ...
J. Hilgert, H. Schmidt, and J. Dos Santos
GKSS Forschungszentrum GmbH, Geesthacht, Germany
Danmarks Tekniske Universitet, Kgs. Lyngby, Denmark
Based on the example of a bobbin tool Friction Stir Welding process model a technique to model thermal processes with a moving geometry in COMSOL is introduced. The described approach allows modeling the transient temperature fields in setups that are governed by a large relative movement of different parts of the geometry. The movement of the tool is realized in a sequence of discrete time ...
P. Lamy-Bracq and C. Coulouarn
Nexter Munitions, Tarbes, France
A solidification process of casting explosives in shell is studied in this paper. An enthalpy method approach is used to model the solidification process. Both the thermal and mechanical effects are taken into account. An ALE (Arbitrary Lagrangian-Eulerian) method is used to represent the physical deformation due to solidification. Results from the model are verified against experimental ...