Jawahar Engineering College, Affliated to Anna University, Chennai, Tamil Nadu, India
Microgrippers are typical MEMS devices used to pick, hold and transport micro-objects. Microgrippers are widely used in the field of micro-assembly, micro-surgery and manipulation of micro-particles. Thermal microgrippers are widely used for large displacement, high accuracy and repeatability. In this paper, a hybrid design electrothermal microgripper (Figure 1), based on Poly Methyl ...
S. Harrison, M. Young, M. Hayne, P. D. Hodgson, R. J. Young, A. Strittmatter, A. Lenz, U. W. Pohl, D. Bimberg
Department of Physics, Lancaster University, Lancaster, UK
Institut für Festkörperphysik, Berlin, Germany
Low-dimensional semiconductor nanostructures, in which charge carriers are confined in a number of spatial dimensions, are the focus of much solid-state physics research, offering superior optical and electronic properties over their bulk counterparts. Both two-dimensional (2D) and zero-dimensional (0D) structures have seen wide-ranging applications in laser diodes, solar cells and LEDs to name ...
H. Schweiger, T. Göstenkors, R. Bau, D. Zielke
Dept. Engineering Sciences and Mathematics, University of Applied Sciences Bielefeld, Bielefeld, Germany
In this paper we want to figure out the development of a capacitive acceleration-sensor system with the FEM-Method. The sensor-system is in the position to detect accelerations in the range of ±20 g. Furthermore the sensor-element contains a printed RF-inductance, which is used for contactless data transfer. On the one hand the simulation of the L-C-oscillating circuit using the RF Module of ...
C. Grau Turuelo, B. Bergmann, C. Breitkopf
Technische Universität Dresden, Dresden, Germany
The void shape evolution of a trench patterned silicon substrate results in diverse cavities by varying initial conditions. The size and the arrangement of the initial trenches are decisive for the transformation process besides the annealing conditions which are, in fact, time and temperature, and the existing pressure values. The prediction of the shape evolution depending on different ...
AC Electrothermal Characterization of Doped-Si Heated Microcantilevers Using Frequency-Domain Finite Element Analysis - new
K. Park, S. Hamian, A. M. Gauffreau, T. Walsh
Mechanical Engineering Department, University of Utah, Salt Lake City, UT, USA
Department of Mechanical, Industrial & Systems Engineering, University of Rhode Island, Kingston, RI, USA
This work investigates the frequency-dependent electrothermal behaviors of freestanding doped-silicon heated microcantilever probes operating under the periodic (ac) Joule heating. The transient heat conduction equation for each component (i.e., the low-doped heater region, the high-doped constriction region, and the high-doped leg region) is solved using the general heat transfer module for DC ...
Powerful automation and optimization methods for Material- and Process analysis with COMSOL Multiphysics and Matlab
SGL Group, Technology & Innovation, Meitingen, Germany
Thomas Frommelt received his PhD in physics in 2007 from the University of Augsburg for experimental work and simulation analysis on acoustically driven microfluidic mixing. In 2008, he joined the SGL Group and introduced COMSOL Multiphysics as the tool for flexible equation based modelling. Since then, he has focused on carbon material and process simulation employing methods of optimization ...
Middle East Technical University
In this study, a detailed finite element model coupling the motion dynamics and electromagnetics of a diaphragm based MEMS vibration energy harvester is presented. The energy harvester converts low frequency vibrations to high frequency response by magnetic actuation of a diaphragm carrying coils. AC/DC, Solid Mechanics and Moving Mesh (ALE) modules are coupled together in one 3-D model to ...
J. Strong, and C. Washburn
Sandia National Laboratories
The newly emerging field of carbon-based MEMS (C-MEMS) attempts to utilize the diverse properties of carbon to push the performance of MEMS devices beyond what is currently achievable. Our design employs a carbon-carbon composite using nano-materials to build a new class of MEMS accelerometer that is hyper-sensitive over a dynamic range from micro-G to hundreds of G’s – far surpassing the ...
N.S. Lawand, J. van Driel, P.J. French
Electronic Instrumentation Laboratory (EILab), Faculty of Electrical Engineering, Mathematics and Computer Science (EEMCS), Delft University of Technology, Delft, The Netherlands
Delft University of Technology, Delft, The Netherlands
Cochlear Implants are implantable devices which bypasses the non-functional inner ear and directly stimulates the hearing nerve with electric currents thus enabling deaf people to experience sound again. Implant electrode array design is limited in electrode count, due to their large size in accordance to scala tympani (ST) with restrictions for deeper insertion in ST thus depriving access to ...
Dr. Piotr Kropelnicki
Mu Xiao Jing
Wan Chia Ang
Andrew B. Randles
Institute of Microelectronics, Agency for Science, Technology and Research, Singapore, Singapore
In this research, we performed multiple COMSOL Multiphysics® simulations. We analyzed the dispersion curves of waves in a LAMB wave pressure sensor; simulated a thin metal film in a microbolometer and observed the resulting stress; investigated the thermal behavior of an acoustic wave microbolometer; and modeled the fluid-structure interaction (FSI) for piezoelectric-based energy harvesting from ...