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- Thermal Management of Buildings
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- Modeling the Lithium-Ion Battery
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- User Presentation 2017
- User Presentation 2016
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- User Presentation 2014
- User Presentation 2013
Additional Reading
Simulation of Cellular Traction Force Based Deflection of PDMS Micropillars - new
J. Wala[1], D. Maji[1], S. Dhara[1], S. Das[1]
[1]Indian Institute of Technology Kharagpur, Kharagpur, West Bengal, India
Cells are complex entities which not only passively sense external stimuli (viz. chemical, optical or mechanical) but also interact with extracellular matrix (ECM) by regulating cellular behavior such as growth, proliferation, migration, etc. Monitoring cell growth and migration of adherent cells becomes a crucial factor in determining cell-cell and cell-substrate interaction, important for ...
MEMS Based Tactile Sensors for Robotic Surgery
V. Nivethitha[1], S. P. Rakavi[1], K. C. Devi[1]
[1]PSG College Of Technology, Coimbatore, Tamil Nadu, India
In this work, a piezoelectric tactile sensor will be designed and simulated using COMSOL Multiphysics®. The sensor is designed in order to assess the pressure exerted on the human body while the robotic surgery is performed. The sensor consists of a rigid and compliant cylindrical element. A circular PDMS (Polydimethylsiloxane) film is sandwiched between the rigid cylinder and the base plate to ...
CMOS Based Atom Chips for Sensor Applications
Ph. Neuman [1], A. Nemecek [1], C. Koller [2]
[1] Department for Micro-and Nanosystems, University of Applied Sciences Wiener Neustadt, Austria
[2] Department for Micro-and Nanosystems, University of Applied Sciences Wiener Neustadt, Austria, and School of Physics and Astronomy, University of Nottingham, Nottingham, UK
Ultra-cold atomic systems have proven over the last decade to be a excellent platform for the realization of quantum sensors, quantum computation or quantum simulation applications. A special implementation of this technology is the so called atom chip, where the magnetic fields generated by wires on a semiconductor chip will result in elaborated trapping potentials for the atomic ensembles. ...
Evaluation of Efficiency Factors of Commercial Thermoelectric Materials Using COMSOL Multiphysics® Software
K. Cadien [1], S. Seif [1], T. Thundat [1],
[1] Department of Chemical & Materials Engineering, University of Alberta, Edmonton, AB, Canada
We have developed single leg model using COMSOL Multiphysics® software to compute Φ of TE materials without using conventional ZT parameters. The Φ were calculated using parametric programming in PDE by using special probe to capture change in power (∆P), ΔT, and area (A), thus (Φ = ∆P/A*ΔT 2). The obtained results showed that the TE material with highest Φ when the temperatures are between 375 ...
Push or Pull, How Does Silk Flow?
J. Sparkes [1],
[1] University of Sheffield, Sheffield, UK
Silk is one of the longest used and most recognizable textiles that we, as a society, use regularly. We see it as a luxury good, worn as an indicator of success and value. However, despite mankind having domesticated and farmed silkworms for millennia, we still know relatively little about the manufacturing process which converts the liquid silk into the fibers we are so familiar with. Increased ...
Multiphysics Modelling of a Micro Valve
F. Bircher[1] and P. Marmet[1]
[1]Institute of Print Technology, Bern University of Applied Sciences, Burgdorf, Switzerland
Electromagnetic micro valves are currently developed empirically or the different physics are treated separately. To accelerate the development-process and for a better understanding of the overall system, a multiphysics simulation is built up. This simulation considers the electromagnetics, the electronics (including the control of the process), the mechanics and the fluidics with respect to ...
Chip Drop After Silver Sintering Process
M.H. Poech[1], M. Weiß[1], and K. Gruber[1]
[1]Fraunhofer Institute for Silicon Technology, Itzehoe, Germany
Since a couple of years, sintering becomes more and more important for power electronics. To press a semiconductor under high temperature in silver paste on a substrate promises benefits for durability. Tests with semiconductors of different thickness expose some problems. After the cool down, some of them fall slightly from the substrate. Stress in the boundary layer, caused by different ...
Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new
N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France
Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...
Surface Plasmon Resonance Dependence on Size in Metallic Nano-Spheres - new
K. Kluczyk[1], W. Jacak[1]
[1]Institute of Physics, Wrocław University of Technology, Wrocław, Poland
Surface plasmon resonance in metallic nanoparticles is highly and shape dependent, which enables varius applications in photovoltaics, photonics, sensing and even medicine. Particularly we observe redshift in plasmon resonance with increasing nanoparticle size. We investigate nanoparticle size influence on plasmon resonance within theoretical and numerical approach and compare results with ...
Study of Pull-In Voltage in MEMS Actuators
P. D. Hanasi[1], B. G. Sheeparamatti[1], B. B. Kirankumar[1]
[1]Basaveshwar Engineering College, Bagalkot, Karnataka, India
Micro cantilevers are the basic MEMS structures, which can be used both as sensors and actuators. The . The objective of this work is to study concept of pull-in voltage and how to reduce the same. Voltage is applied to upper cantilever beam and lower contact electrode is made as ground. By increasing common area between cantilever beam and contact electrode, and also by reducing thickness of ...