Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Simulation of DC Current Sensor

K. Suresh, B.V.M.P.S. Kumar, U.V. Kumar, M. Umapathy, and G. Uma
National Institute of Technology Tiruchirapalli, Tamil Nadu, India

A proximity DC current sensor using of a piezo sensed and actuated cantilever beam with a permanent magnet mounted at its free end is designed and simulated in COMSOL Multiphysics. The change in resonant frequency of cantilever is a measure of the current through the wire. The sensor is found to be linear with good sensitivity.

COMSOL API Based Toolbox for the Mixed-Level Modeling of Squeeze-Film Damping in MEMS: Simulation and Experimental Validation

M. Niessner[1], G. Schrag[1], J. Iannacci[2], and G. Wachutka[1]
[1]Institute for Physics of Electrotechnology, Munich University of Technology, Munich, Germany
[2]MEMS Research Unit, Fondazione Bruno Kessler, Povo di Trento, Italy

We present an easy-to-use toolbox for the automated generation of reduced-order mixed-level models for the evaluation of squeeze-film damping in microelectromechanical systems. The toolbox is programmed in JAVA and heavily exploits the functionality provided by the COMSOL API. The results obtained from mixed-level model simulation performed in COMSOL Multiphysics agree very well with ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

Design and Analysis of Stacked Micromirrors

S. Park, S. Chung, and J. Yeow

University of Waterloo, Systems Design Engineering, Waterloo, Ontario, Canada

A micromirror or a torsional actuator in general has been proven to be one of the most popular actuators fabricated by Micro-Electro-Mechanical System (MEMS) technology in many industrial and biomedical applications such as RF switches, a laser scanning display, an optical switch matrix, and biomedical image systems. In this paper, two stacked micromirrors are presented and analyzed to show ...

Computational Simulation of Electrohydrodynamic Systems Pertaining to Micro and Nano scale Fluid Flow Phenomenon

M. Seiler[1], and B. Kirby[2]
[1]Department of Engineering Physics, Cornell
University, NY, USA
[2]Department of Mechanical Engineering, Cornell
University, NY, USA

Modeling of 3D AC electro-osmotic pumps is relevant to the creation of portable or implantable lab-on-a-chip devices for mm/s tunable fluid flows attainable with battery scale voltages. In this analysis using COMSOL Multiphysics we investigate the modeling challenges of computationally calculating systems of fluid flow phenomena governed by AC Electroosmosis in the micro and nano scale regimes.

Experimentally Matched Finite Element Modeling of Thermally Actuated SOI MEMS Micro-Grippers Using COMSOL Multiphysics

M. Guvench[1], and J. Crosby[1]
[1]University of Southern Maine, Gorham, Maine, USA

In “Micro-Electro-Mechanical-Systems” shortly known as MEMS, one of the most important and effective principle of creating transduction of electrical power to displacement force is thermal expansion. A slim beam of MEMS material, typically Silicon, is heated by the application of electrical current via Joule heating; it expands and creates motion. In the design of many MEMS devices ...

Study of Fluid and Mass Adsorption Model in the QCM-D Sensor for Characterization of Biomolecular Interaction

H.J. Kwon[1], C.K. Bradfield[1], B.T. Dodge[1], and G.S. Agoki[1]
[1]Department of Engineering and Computer Science, Andrews University, Berrien Springs, Michigan, USA

Increasing attention has been paid to application of the quartz crystal microbalance with dissipation (QCM-D) sensor for monitoring biomolecular interactions. This paper focuses on a practical application of protein-protein binding affinity measurement at low concentrations and minimal sample sizes (50-200 μl of 20-200 nM), which results in low signal measurement. A model simulating fluid ...

Design and Simulation of MEMS-based Sensor for Artificial Hand

P. Prema[1], Sakthivishnu.R[1], Sowmya. R[1], Chandra Devi K[1], Meenakshi Sundaram. N[1]
[1]PSG College of Technology, Coimbatore, Tamil Nadu, India

An artificial hand is the one that replaces the hand lost through trauma, disease, or congenital conditions. The proposed design is to simulate a sensor, used in prosthetic hand so as to measure the pressure required to hold the object, using COMSOL Multiphysics®. The physical parameters such as size, shape and mass of the object were optimized so as to hold an object. The weight of the object ...

Heterodimensional Charge-Carrier Confinement in Sub-Monolayer InAs in GaAs - new

S. Harrison[1], M. Young[1], M. Hayne[1], P. D. Hodgson[1], R. J. Young[1], A. Strittmatter[2], A. Lenz[2], U. W. Pohl[2], D. Bimberg[2]
[1]Department of Physics, Lancaster University, Lancaster, UK
[2]Institut für Festkörperphysik, Berlin, Germany

Low-dimensional semiconductor nanostructures, in which charge carriers are confined in a number of spatial dimensions, are the focus of much solid-state physics research, offering superior optical and electronic properties over their bulk counterparts. Both two-dimensional (2D) and zero-dimensional (0D) structures have seen wide-ranging applications in laser diodes, solar cells and LEDs to name ...

Design of an Electrodynamically Actuated Microvalve Using COMSOL Multiphysics® and MATLAB®

M. Williams, J. Zito, J. Agashe, A. Sopeju, and D. Arnold
University of Florida, Gainesville, USA

This paper describes the design of a normally closed, electrodynamic microvalve.  Magnetic forces between a permanent magnet in the valve cover and a soft magnet in the valve seat hold the valve closed.  The combination of electrodynamic actuation and a mechanical restoring spring are used to open the valve.  A device model and a design optimization strategy using COMSOL ...