Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

COMSOL在压阻式柔性压力传感器中的应用

王宗荣 [1,2], 王珊 [1],
[1] 浙江大学,杭州,中国
[2] 香港大学,香港,中国

引言:柔性压力传感器在电子皮肤、智能假肢以及医疗监测诊断等领域发挥着十分重要的作用。因此压力传感器需要很高的灵敏度、较宽的敏感区间及稳定的性能。利用典型有机硅 PDMS 作为支撑层,聚合物 PEDOT: PSS 作为导电感应层制得的高度不均一微突结构的双压敏机制压阻传感器灵敏度达到了 851kPa-1。其探测范围广,性能优异,为解决目前压阻传感器中灵敏度低、敏感压力区间窄的难题提供了新思路。 COMSOL MULTIPHYSICS® 软件的使用:本文利用 COMSOL Multiphysics® 软件建立了不均匀微突结构的压阻式传感器模型,采用了结构力学与电流场两个物理场,通过电子接触对进行多物理场的耦合。研究在指定位移情况下,压阻式传感器电阻与电流的变化,从而得到灵敏度,验证不均匀微突结构压阻式压力传感器的双作用机制。同时,与均一微金字塔结构的压力传感器进行比较 ...

Study of Thermal Behavior of Thermoset Polymer Matrix Filled with Micro and Nanoparticles

B. Reine[1], J. Di-Tomaso[2], G. Dusserre[1], P. Olivier[1]
[1]Université de Toulouse, UPS, INSA, Mines Albi, ISAE, ICA, IUT, Dept. GMP, Toulouse Cedex, France
[2]RESCOLL - Société de Recherche, Pessac Cedex, France

This paper addresses the study of thermal behavior of thermoset polymer matrix filled with microparticles. A numerical model was developed with COMSOL Multiphysics to get a random spatial distribution of fillers in a representative volume element (RVE). This model was then compared to an analytical reference model (Hamilton model) and experimental results. This comparison highlights a good ...

Design of an Electrodynamically Actuated Microvalve Using COMSOL Multiphysics® and MATLAB®

M. Williams, J. Zito, J. Agashe, A. Sopeju, and D. Arnold
University of Florida, Gainesville, USA

This paper describes the design of a normally closed, electrodynamic microvalve.  Magnetic forces between a permanent magnet in the valve cover and a soft magnet in the valve seat hold the valve closed.  The combination of electrodynamic actuation and a mechanical restoring spring are used to open the valve.  A device model and a design optimization strategy using COMSOL ...

COMSOL API Based Toolbox for the Mixed-Level Modeling of Squeeze-Film Damping in MEMS: Simulation and Experimental Validation

M. Niessner[1], G. Schrag[1], J. Iannacci[2], and G. Wachutka[1]
[1]Institute for Physics of Electrotechnology, Munich University of Technology, Munich, Germany
[2]MEMS Research Unit, Fondazione Bruno Kessler, Povo di Trento, Italy

We present an easy-to-use toolbox for the automated generation of reduced-order mixed-level models for the evaluation of squeeze-film damping in microelectromechanical systems. The toolbox is programmed in JAVA and heavily exploits the functionality provided by the COMSOL API. The results obtained from mixed-level model simulation performed in COMSOL Multiphysics agree very well with ...

Reliability Enhancement of Bio MEMS based Cantilever Array Sensors for Antigen Detection System using Heterogeneous Modular Redundancy

L. S. Sundharam[1]
[1]Kumaraguru college of Technology, Coimbatore, Tamil nadu, India

The objective of the work is to propose a reliability enhancement model for antigen detection system (ADS) using bio MEMS based cantilever array sensors using heterogeneous modular redundancy technique. The reliability of the ADS is expressed in terms of the constituent sub systems which are heterogeneous not only in their respective structures and behaviors but also in their forms. The possible ...

Multiphysics and Simulation of MEMS based Bolometer for Detecting the Radiations in Nuclear Power Plants

K. Umapathi[1], S. Swetha[2], K. Ranjitha[2], K. Vinodh[2], K. Deebiga[1], R. Harisudarsan[1]
[1]United Institute of Technology, Coimbatore, TamilNadu, India
[2]Sri Krishna College of Engineering and Technology, Coimbatore, Tamil Nadu, India

High performance micro sensors are important to detecting special nuclear materials radiations in different fields to save the globe. This paper is mainly focused on to develop a MEMS based bolometer for detecting the nuclear radiation to provide the high security in Nuclear power Plants. A thermally sensitive micro metal plate is designed and placed on a substrate through micro thermal link. ...

Thermomechanical Effects of the Packaging Molding Process on the Chip in Integrated Circuits - new

N. Semmar[1], M. Fournier[1], P. S. Alleaume [2], A. Seigneurin [3], , ,
[1]GREMI-UMR7344, CNRS/University of Orléans, Orléans, France
[2]Collegium Sciences et Techniques, Orléans, France
[3]ST Microelectronics Tours SAS, Tours, France

Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have all different thermoelastic properties, these stress can be critical for the chip connections. To ...

Analog to Digital Microfluidic Converter

R. Dufour [1], C. Wu[1], F. Bendriaa[1], V. Thomy[1], and V. Senez[1]
[1]BioMEMS Group, IEMN, University of Lille Nord de France, Villeneuve d’Ascq, France

This paper presents an Analog to Digital Microfluidic Converter (ADMC) using passive valves and enabling the conversion of a continuous liquid flow into droplets for Electro-Wetting On Dielectric (EWOD) actuation. Valves calibration, geometry characteristics and losses reduction have been optimized using microfluidic application mode of COMSOL Multiphysics®.

Optimized Cantilever-to-Anchor Configurations of Buckled Cantilever Plate Structures for Transducer Applications

A. Arpys Arevalo Carreno[1], D. Conchouso Gonzalez[1], I.G. Foulds[1]
[1]King Abdullah University of Science and Technology, Thuwal, Mecca, Kingdom of Saudi Arabia

The mechanical simulation and analysis of the cantilever-to-anchor configuration for an out-of-plane structure used in transducer applications is reported. The polymer-based Buckled Cantilever Plate “BCP” structure, gives the ability to orient an active device from a horizontal to a vertical position, once assembled. In this paper we compare four different cantilever-to-anchor configurations: ...

Quartz Transducer Modeling for Development of BAW Resonators

L.B.M. Silva[1], E.J.P. Santos[1]
[1]Laboratory for Devices and Nanostructures, Electronics and Systems Department, Universidade Federal de Pernambuco, Recife, PE, Brasil

Transducer optimization is a key aspect for successful development and deployment of advanced sensors, especially when designing 3D structures for harsh environments. For piezoelectric transducers, plate thickness determines the operating frequency of the resonator, which is frequently tuned in the shear thickness vibration mode. Quartz has been the material of choice for the fabrication of ...