Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Acoustic Wave Crack Detection: A First Principles Approach

R. W. Pryor [1],
[1] Pryor Knowledge Systems, Inc., Bloomfield Hills, MI, USA

Crack detection is and has been an active field of exploration, both theoretical and applied for a number of years. It is the belief of this author that the concepts presented herein explore a new methodology for the modeling and the detection of cracks and families of cracks in crystalline solids, polycrystalline solids and high viscosity amorphous materials (glasses). In the case of the ...

Modeling of Residual Stresses in a Butt-welded Joint with Experimental Validation

V. Srivastava [1],
[1] Naval Materials Research Laboratory (NMRL), Defence Research and Development Organization (DRDO), Ambernath, Thane, Maharashtra, India

2D-modeling of arc welding in butt-joint configuration was performed in this study considering thermal-structural interactions. Thermal behavior was modeled in COMSOL Multiphysics® using the Heat Transfer Module with weld heat input as a Gaussian pulse whereas structural behavior using Structural Mechanics Module. Thermal-elastic-plastic behavior model based on Von Mises yield criteria and ...

Numerical Study on Mechanical Properties of Stents with Different Materials during Stent Deployment with Balloon Expansion.

P. Ghosh[1], K. DasGupta[1], D. Nag[2], and A. Chanda[1]
[1]School of Bio Science & Engineering, Jadavpur University, Kolkata, West Bengal, India
[2]Mechanical Engineering Department, Jadavpur University, Kolkata, West Bengal, India

The main reason for stent implantation is to provide mechanical support to the arterial wall. So it is important to consider the different mechanical properties of different stent materials while studying the stent implant’s efficacy. The present study gives a comparative overview of mechanical aspects of different stent materials which are most commonly used in angioplasty. Deformation ...

Design and Simulation of 3D ZnO Nanowire Based Gas Sensors for Conductivity Studies

N. Gouthami, D. Parthiban, M. Alagappan, and G. Anju
PSG College of Technology
Tamil Nadu, India

The objective of this paper is to design a 3D Gas Sensor for sensing Hydrogen gas and to increase the conductivity at nano level. In this novel design, nanorods act as the sensing layer. The sensitivity towards gas adsorption is found to be increased due to its high surface to volume ratio. The total displacement and voltage on intermediate layer after gas adsorption will be changing by varying ...

Evaluation of Novel Wing Design for UAV - new

P. K. Bahumanyam[1]
[1]University of Alabama in Huntsville, Huntsville, AL, USA

Viable design alternative for the existing and fast growing UAVs which are optimized for unmanned flight is of great demand. Designing of a small scale UAV alternative to the AAI Aerosonde UAV has been considered changing the wing tail configuration of the vehicle analyzing both structural and aerodynamic performance improvements using COMSOL Multiphysics® software.

Analysis of Static Stress in a Bicycle Chain Plate

M. Wagner [1], T. Koch [2], I. Kühne [3], A. Frey [1]
[1] Augsburg University of Applied Sciences, Augsburg, Germany
[2] Comsol Multiphysics GmbH, Göttingen, Germany
[3] Heilbronn University, Kuenzelsau, Germany

Using the Solid Mechanics interface, a model is set up to investigate the impact of static stress on a bicycle chain for different geometries related to three chain generations. A contact model is used to induce the stress. Plastic deformation is taken into account. Based on the simulation results the contribution of plastic deformation to lifetime restriction can be estimated. The results ...

MEMS Electrostatic Acoustic Pixel

A. Arevalo [1], D. Conchouso [1], D. Castro [1], I. G. Foulds [2],
[1] Computer, Electrical, & Mathematical Sciences & Engineering, King Abdullah University of Science and Technology, Thuwal, Saudi Arabia
[2] The University of British Columbia, School of Engineering, Vancouver, BC, Canada

The growth of the electronics industry demand better components for the electronic systems. Such components need to be improve to keep up with the evolution of the digital era. The loudspeaker design has not been changed for almost a century [1-5]. The acoustic transducer is the last analogue component needed for a true digital audio system. We want to validate the feasibility of using an ...

Key-Holes Magnetron Design and Multiphysics Simulation

A. Leggieri[1], F. Di Paolo[1], D. Passi[1]
[1]Univeristy of Rome "Tor Vergata" - Department of Electronic Engineering, Rome, Italy

This paper describes the design and characterization of an 8 slots resonant cavity Magnetron, which undergoes thermal-structural effects due to cathode heating. The proposed study involves Thermal Stress, Eigen-frequency and Particle Tracing analysis based on COMSOL Multiphysics®. Magnetrons are well known and often utilized High Power Radiofrequency Vacuum Tube oscillators. In order to ...

Full Coupling of Flow, Thermal and Mechanical Effects in COMSOL Multiphysics® for Simulation of Enhanced Geothermal Reservoirs

D. Sijacic[1], P. Fokker[1]
[1]TNO, Utrecht, The Netherlands

The effective modeling of enhanced geothermal systems (EGS) requires the coupling of geomechanics, fluid flow and thermal processes. An understanding of the complete system with these coupled processes is vital, not just for reservoir stimulation targeted at enhancing reservoir performance, but also for the understanding, prediction and prevention of induced seismicity. Thermal effects however ...

Design and Simulation of 3D MEMS Piezoelectric Gyroscope using COMSOL Multiphysics®

T.Madhuranath[1], R.Praharsha[1], Dr.K.Srinivasa Rao[1]
[1]Lakireddy Bali Reddy College of Engineering, Mylavaram, Andhra Pradesh, India

MEMS is the leading technology which combines both electronic and mechanical devices on a single microchip. Tracing the position of the object is an important problem in engineering. This can be addressed by Gyroscopes. These sensors are used to find orientation and angular velocity. This paper focuses on 3D MEMS Piezoelectric Gyroscope. COMSOL Multiphysics® is used for designing and ...