COMSOL Day: Semiconductor Processing
See what is possible with multiphysics modeling
COMSOL Day: Semiconductor Processing is a one-day online event that will explore the use of physics-based simulation in the semiconductor processing industry. With the goal of keeping up with advancements in technology, engineers are using multiphysics simulation to develop next-generation semiconductor products. Throughout the day's sessions, various topics will be covered, including fluid flow analysis, charged particle tracing, optics analysis, and the effects of heat radiation, acoustics and vibration, and mechanical contact.
Attendees will learn how to utilize COMSOL Multiphysics® to optimize semiconductor manufacturing processes and enhance the quality and efficiency of their simulation tasks.
In order to keep up with Moore’s law, accuracies up to the nanometer level are needed in semiconductor manufacturing. Semiconductor processing involves multiple physics phenomena that are often strongly coupled. Multiphysics modeling and simulation are therefore essential for creating next-generation semiconductor devices. COMSOL Multiphysics® makes such modeling easy, and it is widely used within this industry.
With COMSOL®, modeling specialists can use multiphysics models to create simulation apps that can be used by a larger community of engineers and scientists. These simulation apps can also be distributed freely as compiled apps. Engineers and scientists can collaborate around models and apps using the Model Manager. This workspace for model and app management leads to more efficient integration and collaboration so that an organization can benefit from multiphysics modeling to a larger extent.
In this session, you will learn about current modeling trends at industrial R&D departments and leading research institutes within the semiconductor processing industry. We will also show how such trends are inspired and enabled by the use of multiphysics modeling and simulation apps.
Jos van Schijndel, ASML
In this presentation, Jos van Schijndel will focus on the use of COMSOL Multiphysics® within ASML’s computational modeling Way of Work. He will discuss where computational tools are used in the V-model of systems development at ASML and how the COMSOL® software fits into the main set of ASML computational tools. He will show applications where it is beneficial to use COMSOL Multiphysics®.
In semiconductor manufacturing, various applications rely on heat treatment, including rapid thermal processing. To prevent dislocations and breakage of wafers and other semiconductor devices, it's essential to optimize the heating and cooling processes. Multiphysics modeling and simulation provides the insight needed to help achieve this goal.
To design and optimize thermal processing, engineers use the COMSOL® software, which provides accurate descriptions of heat conduction, convection, and radiation as well as conjugate heat transfer. It also enables users to simulate multiphysics phenomena such as Joule heating, thermal expansion, temperature-dependent chemical reactions, and phase change.
Join us in this session to learn more about the COMSOL® software's capabilities for modeling heat transfer, heat generation, and thermal processing. We will walk through some examples of how the software can be used, which will demonstrate how easy it is to create high-fidelity models with COMSOL Multiphysics®.
Particle tracing modeling and simulation are crucial for accurately predicting the motion of ions or electrons in electric or magnetic fields. Even the smallest leakage current can result in a particle that can damage a chip. Such leakage currents can arise from phenomena such as cold field emission or Townsend discharges. Particle tracing can be used to model these effects, leading to a deeper understanding and the optimization of the process.
The Particle Tracing Module is equipped with specialized functionality for these types of models. The software offers various predefined forces that affect the motion of particles, such as electric, magnetic, gravitational, and collisional forces. Additionally, users can incorporate custom-defined expressions to account for the particles' interactions with other fields. Furthermore, the software contains unique functionality for using bidirectional couplings between fields and particles, specifically for situations where particles impact electromagnetic fields.
Join us in this session to discover more about the capabilities of the Particle Tracing Module and hear about how to optimize its use for creating charged particle tracing models and simulations.
COMSOL Multiphysics® allows for the import of a wide range of CAD and ECAD formats that can be used as input in modeling and simulation. This makes it possible to use real-world geometries and thus obtain high-fidelity descriptions of processes that involve multiple physics phenomena.
In this session, you will get a look at the features in COMSOL Multiphysics® for preparing CAD designs for analysis. The software includes a wide range of features for defeaturing and simplifying the geometry, as well as for carefully designing the mesh. During this process, the software is able to retain the details relevant to the involved physics phenomena while keeping the solution time and memory requirements within reasonable limits. We will demonstrate using the functionality for finding and deleting small geometric entities, finding and resolving gaps and overlaps between objects, fine-tuning the mesh element size, and generating structured meshes.
Rapid photolithographic patterning in semiconductor manufacturing requires highly accurate and intense light exposure. Multiphysics modeling and simulation are used to understand and optimize the optical system that delivers this light.
COMSOL Multiphysics® and the Ray Optics Module are well suited for this type of analysis. The software provides a wide range of features that make it possible to use geometrical optics to compute various optical properties, such as intensity, phase, optical path length, wavelength distribution, and ray propagation in absorbing media. Furthermore, the software contains unique features for modeling the interplay between geometrical optics, ray heating, heat transfer, and structural mechanics. These analyses are commonly referred to as structural-thermal-optical performance (STOP) analyses.
In this session, you will learn how STOP analyses can be carried out using COMSOL Multiphysics®. We will demonstrate the unique usability of the Ray Optics Module for performing this type of analysis.
Learn the fundamental workflow of COMSOL Multiphysics®. This introductory demonstration will show you all of the key modeling steps, including geometry creation, setting up physics, meshing, solving, and postprocessing.
Jeroen van Duivenbode, ASML
The electric field inside and around a uniformly polarized sphere has been studied since the age of Maxwell and is relevant for widespread purposes ranging from molecular interaction to partial discharges in dielectrics and the transport of small particles. Recently, it became clear that the wrong equation may have been used for more than 150 years. In this keynote talk, Jeroen van Duivenbode will explain how field analysis with the COMSOL Multiphysics® software facilitated finding the wrong turn that was taken in the past.
Fluid flow has a significant impact on semiconductor processing, and it is commonly examined through modeling and simulation. COMSOL Multiphysics® is used extensively for investigating fluid flows in various regimes, ranging from rarefied flow to viscous and turbulent flow. In addition, the software has unique multiphysics capabilities for modeling flow in combination with other physics phenomena, such as in reacting flows, conjugate heat transfer, electrokinetic flow, and magnetohydrodynamics.
Join us in this session to learn about the CFD capabilities in COMSOL Multiphysics® and the ability to create multiphysics models involving fluid flow.
To meet the demands for precision in semiconductor device processing, manufacturing equipment needs to exhibit the highest degree of accuracy. Mechanical contact is important to various aspects of semiconductor processing, such as the contact between the reticle and surrounding parts, wafer placement, and subsequent alignment. Mechanical contact analyses can be combined with thermal stress analyses to provide even greater accuracy when modeling semiconductor processing.
COMSOL Multiphysics® version 6.1 introduces new functionality that enables faster and more robust modeling of contact for solids, shells, and membranes, with full support for self-contact. It also features the unique capability to combine contact analysis with multiphysics effects, such as thermal contact, electrical contact, and more.
In this session, we will demonstrate the capabilities of the Structural Mechanics Module for analyzing mechanical contact and show you how this functionality can be utilized for modeling and simulation of semiconductor processing.
Modeling and simulation are no longer limited to the expertise of a few individuals within an organization. The availability of simulation tools throughout the product or process design workflow — from R&D to the factory floor — allows for a more collaborative and innovative approach to problem-solving. Now, even those without prior modeling knowledge can contribute to the process, leveraging the expertise of modeling experts.
To facilitate this collaboration, the Application Builder in COMSOL Multiphysics® allows modeling experts to create custom apps with user-friendly interfaces that can be used by scientists and engineers without modeling experience. These simulation apps serve to simplify the modeling process and extend the functionality of simulations to more users, regardless of their skill level.
By using the Application Builder together with the COMSOL Multiphysics® platform's built-in Model Builder and Model Manager tools, engineering organizations can establish an efficient, collaborative, simulation-based environment to foster innovation.
In this session, you will learn how to use the Application Builder to create simulation apps and how to distribute them for use by others.
Acoustic pressure waves in fluids such as air or water interact with surrounding structures resulting in vibrations in solids and absorption in porous materials, and are easily modeled by the Acoustics Module and COMSOL Multiphysics®. Furthermore, in narrow and microstructures, thermal and viscous losses in the fluid become significant and need to be included in any modeling analysis. In this session, we will demonstrate the features of the Acoustics Module to illustrate the simulation of these waves, subsequent losses, and their effects. Also to be discussed are techniques for improving both model accuracy and runtime as well as advanced postprocessing for acoustic waves.
Register for COMSOL Day: Semiconductor Processing
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