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Using the assembly form
Posted May 6, 2013, 9:28 AM EDT MEMS & Nanotechnology, MEMS & Nanotechnology, Structural Mechanics & Thermal Stresses Version 4.3 0 Replies
I am trying to simulate with "piezolectric devices". Specifically, I would like to exert stress on a thin film in contact with a piezoelectric 3D block. The geometry is quite simple but in order to mesh the thin film using "swept" I have to use "assembly" finish form (if I am right).
The problem is that during the simulation, it seems that both 3D piezoelectric block and thin film does not interact in any way (i.e. stress is not exerted).
I have played with "contact pairs" and "indetity pairs" with no success ! I am getting desesperate.
Any suggestion ?
Hello Javier Martin
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