The Application Gallery features COMSOL Multiphysics® tutorial and demo app files pertinent to the electrical, structural, acoustics, fluid, heat, and chemical disciplines. You can use these examples as a starting point for your own simulation work by downloading the tutorial model or demo app file and its accompanying instructions.
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Diffuse Double Layer
At the electrode-electrolyte interface, there is a thin layer of space charge in a diffuse double layer. This may be of interest when modeling devices such as electrochemical capacitors and nanoelectrodes. This tutorial example shows how to couple the Nernst-Planck equations to the Poisson equation, in order to describe diffuse double layer according to a Gouy-Chapman-Stern model. The physics ...
Electrochemical Impedance Spectroscopy
Electrochemical impedance spectroscopy (EIS) is a common technique in electroanalysis. It is used to study the harmonic response of an electrochemical system. A small, sinusoidal variation is applied to the potential at the working electrode, and the resulting current is analyzed in the frequency domain. The real and imaginary components of the impedance give information about the kinetic and ...
Cyclic Voltammetry
Cyclic voltammetry is a common analytical technique for investigating electrochemical systems. In this method, the potential difference between a working electrode and a reference electrode is swept linearly in time from a start potential to a vertex potential, and back again. The current-voltage waveform, called a voltammogram, provides information about the reactivity and mass transport ...
Copper Deposition in a Trench
This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary, Nernst-Planck interface for electrodeposition to keep track of the deformation of the mesh. Furthermore, electrochemical reaction kinetics through use of the Butler ...
Orange Battery
This tutorial example models the currents and the concentration of dissolved metal ions in a battery (corrosion cell) made from an orange and two metal nails. This type of battery is commonly used in chemistry lessons. Instead of an orange, lemons or potatoes can also be used.
Decorative Plating
Tutorial model of electroplating. The model uses secondary current distribution with full Butler-Volmer kinetics for both anode and cathode. The thickness of the deposited layer at the cathode is computed as well as the pattern caused by dissolution of the anode surface.
Voltammetry at a Microdisk Electrode
Voltammetry is modeled at a microelectrode of 10um radius. In this common analytical electrochemistry technique, the potential at a working electrode is swept up and down and the current is recorded. The current-voltage waveform ("voltammogram") gives information about the reactivity and mass transport properties of the analyte. Microelectrodes are popular in electroanalysis because they ...
Electrochemical Machining of a Micro Bore
For several high-precision applications, especially in hydraulic systems and fuel injectors, micro bores are needed. In most cases the shape of the injection hole, especially the edge rounding, has a significant influence on the atomization of fluids and therefore on the combustion process. Usually these micro bores are machined by electrical discharge machining (EDM). Due to the process ...
Copper electrodeposition in a trench using the level set method
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, the original model cannot be extended to simulate deposition after cavity formation. In the present model, ...
Electrodeposition of a Microconnector Bump in 2D
This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal displays (LCDs) and driver chips. The location of the bumps on the electrode surface is controlled by the use ...
