See How Modeling and Simulation Is Used Across Industries
Multiphysics modeling and simulation drives innovation across industries and academia — as is evidenced by the many uses showcased in the technical papers and posters presented by engineers, researchers, and scientists at the COMSOL Conference each year.
Draw inspiration from the recent proceedings collected below, or, to find a specific presentation or filter by application area or conference year/location, use the Quick Search tool.
View the COMSOL Conference 2025 Collection
The current paper focuses on the creation of a consistent environment for the numerical prediction of the physical properties of polymer composite. A limitation factor for the successful simulation of composite processes is the correct estimation of the effective properties depending on ... Read More
Large deflection actuators are becoming increasingly important for microsystems. Since actuation forces are usually small, large deflection actuators usually require flexures with low stiffness. Rectangular serpentine flexures are often used for such actuators due to their low stiffness ... Read More
New giant piezoelectric factor materials such as PMN-PT and PZN-PT were researched during the last decade and are actually becoming commercially available. As they seem very attractive for actuator designs, we studied their potential in replacing PZT ceramics. In a first comparative ... Read More
A small particle or a nano-sized object placed in a liquid is subject to random collisions with solvent molecules. The resulting erratic movement of the object is known as Brownian motion, which, in nature, cannot be used to any practical advantage both in natural systems (such as ... Read More
Outline of presentation: theory of phase-field modeling of ferroelectric materials parameter identification in free energy density finite element implementation: PDE form weak form periodic boundary conditions: electrical mechanical domain configurations intrinsic and extrinsic ... Read More
The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott potential, defects on the microstructure and oxide volume increase per ionic defect. An emphasis is laid on magnetic nanoparticles where the degree of oxidation can be measured ... Read More
Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... Read More
Capacitor Discharge Sintering (CDS) is an ultrafast Electric Current Assisted Sintering method (u-ECAS) suited for electrically conductive powders. It is characterized by relatively short processing times (milliseconds range) and much lower sintering temperatures than the melting point ... Read More
The excessive presence of residual SiC matrix inter-fiber pores is often the main cause for the very poor mechanical strength and toughness of SiC/SiC composites manufactured by CVI (Chemical Vapour Infiltration) process. This work presents a micro/macro Microwaveassisted Chemical Vapour ... Read More
Dynamic measurement of magnetic particles in continuous flow devices is made very difficult by the limitations imposed by the sensors themselves. Thus, certain sensor layouts are restricted to either number sensitive or spatial resolutive measurements of magnetic particles. We ... Read More