COMSOL Multiphysics Seminar - Together with CMC Microsystems

May 2, 2024 11:00 a.m.–3:00 p.m. EDT

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Hosted together with CMC Microsystems

Modeling and simulation (M&S) has been established as the third major pillar of scientific investigation, alongside experiment and theory, and the COMSOL Multiphysics® software has become the premier platform for this work. Engineers and scientists turn to COMSOL Multiphysics® for its ability to couple any combination of multiphysics phenomena and its features for creating specialized simulation apps for specific engineering and scientific uses.

Join us for a COMSOL Multiphysics® Seminar, a 1-day online event that will focus on the use of physics-based simulation in the design and development of a variety of applications, including electronic components and semiconductor devices. The event will be hosted together with CMC Microsystems, an organization that accelerates research and provides access to COMSOL Multiphysics® to various university departments and research institutes throughout Canada.


11:00 a.m.

To start, we will briefly discuss the format of the day and go over the logistics for using GoToWebinar.

11:10 a.m.
CMC Microsystems: Accelerating Research and Innovation in Advanced Technologies
11:30 a.m.

Understanding the electromagnetic behavior of coils, solenoids, and other inductive devices is of fundamental importance in electromagnetic design. COMSOL Multiphysics® features tailored functionality for the modeling and simulation of such devices. In addition, it provides unique capabilities for multiphysics modeling involving electromagnetic fields coupled with heat transfer, electromechanical forces, and other physics phenomena.

In this session, we will give an overview of using the AC/DC Module to compute the inductance, resistance, and impedance of inductors, including transformers. We will also discuss inductive heating and electromagnetic forces as well as optimizing coil shapes to achieve a desired magnetic field.

If you’re interested in learning about the features available for modeling coils, attend this session!

12:00 p.m.
12:15 p.m.

When devices have geometric details with dimensions close to those of the thermal and viscous boundary layers, it becomes important to consider thermoviscous losses.

Thermoviscous losses are especially pronounced in structures with submillimeter features where acoustic propagation occurs, such as in components of handheld devices, loudspeaker grilles, earbuds, hearing aids, MEMS transducers, and perforates used in mufflers and for sound insulation.

With COMSOL Multiphysics® and the Acoustics Module, you can easily model such devices by utilizing the software's built-in features for modeling thermoviscous losses. For multiphysics simulations, the losses can be included in vibroacoustic settings or transducer models, where electromechanical forces can be coupled. For MEMS device modeling, the software includes a dedicated acoustic slip-flow formulation. Additionally, there are integrated solutions available for combining with and coupling to lumped electroacoustic representations.

In this session, you will learn modeling techniques for capturing these effects, including how to set up multiphysics models. You will also get an introduction to modeling microacoustics systems that include nonlinear effects.

12:45 p.m.
1:00 p.m.

Fluid flow and energy transport directly affect each other and should always be coupled to each, and solved together, when simulating their systems. During this session, we will describe how to simulate natural and forced convection and how to take into account classical effects such as pressure work, viscous dissipation, the Joule–Thomson effect, and more.

We will also show how to optimize computational performance and resources by using different modeling strategies with the corresponding built-in options available in COMSOL Multiphysics® (incompressible, weakly compressible, and compressible flow; the Boussinesq approximation; the ideal gas model; etc.) Finally, we will demonstrate how to check your solution using the mass and energy balances in a model.

1:30 p.m.

Bring your modeling questions to ask COMSOL technical staff. Questions will be answered live and should be of general interest to event attendees.

1:45 p.m.

Thermal treatment and heat transfer are common processes involved in semiconductor processing. Physical modeling is used to better understand the impact of temperature changes and gradients in fragile semiconductor devices. Using modeling and simulation can help with decision making in design, optimization, and product quality control.

The COMSOL Multiphysics® software is widely used for modeling thermal stresses and strains to predict a device's failure susceptibility. It boasts a broad range of heat transfer modeling capabilities, including thermal contact, natural and forced convection, thermal radiation, and heat transfer in layered materials. It also offers unique functionality for modeling various heating mechanisms together with thermal stresses, such as Joule heating and other types of electromagnetic heating.

In this session, we invite you to learn more about the capabilities of COMSOL Multiphysics® for modeling thermal stresses and strains in semiconductor processing. You will see demonstrations of defining thermal expansion input parameters and temperature-dependent nonlinear materials.

2:15 p.m.
2:30 p.m.

The COMSOL® software aids in different processes in the field of renewable energy. It offers unique modeling and simulation (M&S) capabilities as well as easy-to-use features for creating standalone simulation apps.

The Application Builder and COMSOL Compiler™ allow for bringing M&S to a larger group of scientists and engineers thanks to their capabilities for creating and deploying simulation apps. These apps can be incorporated into digital twins for use in equipment maintenance and process operation. The latest release of COMSOL Multiphysics® contains functionality for creating surrogate models based on data from simulations and advanced function approximation such as DNN and Gaussian process, making simulation apps lightning-fast.

In this session, you’ll learn about the COMSOL® software’s capabilities for creating simulation apps and digital twins.

3:00 p.m.
Closing Remarks

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Meeting Details