ECAD Import Module Updates
New Elevation Option for IPC-2581 and ODB++ File Import
For users of the ECAD Import Module, COMSOL Multiphysics® version 6.2 expands the import functionality for the IPC-2581 and ODB++ PCB formats with a new Metal layer between dielectric layers elevation option. When importing and creating a PCB geometry using this option, the interior copper layers are positioned such that their thickness contributes to the overall board thickness. In previous versions, this was possible by manually specifying the layer elevations.
Support for implementation of the ODB++ format was provided by Mentor Graphics Corporation pursuant to the ODB++ Solutions Development Partnership General Terms and Conditions.