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Fluid & Heat Blog Posts

Predicting How Long Coffee Stays Warm in a Vacuum Flask

October 26, 2017

Do you use a vacuum flask to keep your coffee or tea warm? Try simulating the natural convection cooling in one of these containers to see exactly how long your beverage will stay warm.

Improving IFE Target Fabrication with a Droplet Microfluidics Method

September 29, 2017

A common joke is that fusion energy is 30 years away, and always will be. Researchers are using simulation to tackle the challenges involved with of inertial fusion energy target production.

Computing Porosity and Permeability in Porous Media with a Submodel

September 27, 2017

Porous materials have complex geometries and may therefore be difficult to model. Setting up a microscale submodel is a useful approach to find the porosity and permeability of the medium.

Studying the Thermal Performance of Phase Change Materials

September 18, 2017

Certain building materials, like plaster, are enhanced with phase change materials (PCMs) to assist in keeping buildings cool in the summer and warm in the winter. But how effective are they?

Analyzing a New Droplet-Forming Fluidic Junction with Simulation

September 8, 2017

A novel oscillatory microfluidic junction design, called a “batwing”, is improving the field of droplet microfluidics by consistently producing uniform and complex double-emulsion droplets.

How to Save Computational Time with a One-Way Coupling Approach

September 6, 2017

Simulating heat transfer in fluids with forced convection can be very computationally expensive. Did you know that you can save a lot of time and resources with a one-way coupling approach?

Using Simulation to Study Ultrasound Focusing for Clinical Applications

August 31, 2017

Guest blogger Thomas Clavet of EMC3 Consulting discusses the simulation of ultrasound focusing via phased array and geometrically focused probe designs for clinical uses.

Simulating the Thermocompression Bonding of an Underfill Adhesive

August 29, 2017

Underfill adhesives are often used in microelectronics to hold different components together. Simulate the thermocompression bonding process of such an adhesive to ensure its effectiveness.


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