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Blog Posts Tagged Heat Transfer Module

How to Perform a STOP Analysis with COMSOL Multiphysics®

November 5, 2018

Interested in structural-thermal-optical performance (STOP) analysis? We go over the theory, background, and how to perform such an analysis in the Ray Optics Module.

Studying the Peltier and Seebeck Effects in Thermoelectric Devices

September 20, 2018

We go over 2 key concepts in themoelectricity, the Seebeck and Peltier effects, and how to account for them when simulating heating and cooling in thermoelectric devices.

Examining Heat Transfer in a Friction Stir Welding Process

August 6, 2018

Friction stir welding (FSW) is an efficient, cost effective, and environmentally friendly process that can be optimized by studying the heat transfer involved via modeling.

Optimizing Thermal Processes in Carbon Manufacturing with Simulation

July 5, 2018

A guest blogger from SGL Carbon GmbH demonstrates how his organization uses heat transfer simulation to optimize thermal processes in carbon manufacturing.

Common Pitfalls in Electrothermal Analysis

April 17, 2018

In the real world, electromagnetic heating often involves a nonlinear temperature. Learn some common pitfalls that occur during this type of electrothermal analysis and how to overcome them.

Using the Inflow Boundary Condition in Nonisothermal Flow Simulations

March 15, 2018

Nonisothermal flow is a multiphysics problem, as it combines CFD and heat transfer analysis. Learn how to implement the Inflow boundary condition when simulating these types of scenarios.

Modeling Phase Change in a Thermosiphon

March 12, 2018

A guest blogger from Noumenon Multiphysics writes about modeling phase change in a thermosiphon, a device that has been keeping houses warm since the 1800s.

Advancing Additive Manufacturing with Sequential Simulations

March 7, 2018

In some ways, additive manufacturing is like sewing or weaving. We talk to a professor of additive manufacturing about how sequential simulations can be used to analyze and optimize the process.


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